tag: Samsung

The Best Foundry Strategy
By Joanne Itow - 21 Feb, 2013 - Comments: 0

By Joanne Itow Today, foundries supply more than 20% of the silicon used to produce all the semiconductor products sold. The foundry impact has grown from only 10% in 1997 to 24% today. The significance of foundries is even more evident when focused on logic wafers alone. Figure 1. Foundry Wafers as a Percent of Total, IC’s, and IC’s Minus Memory [caption id="attachment_7339" align="... » read more

Making The Right Choices
By Ed Sperling - 21 Feb, 2013 - Comments: 0

FD-SOI at 28nm, or finFETs at 20/14nm? To companies looking at the cost equation, the total market opportunity for SoCs and the NRE required to get there, this is still a manageable formula. It requires lots of number crunching and some unknowns, but by the time you get done with the math it still falls within an acceptable margin of error and the choices are relatively simple. For foundries... » read more

Pyramids Are Not Just For Pharaohs
By Michael Watts - 17 Feb, 2013 - Comments: 1

By Mike Watts There were 3 different applications for pyramid patterns this year at Photonics West in San Francisco; improved LED’s, improved absorbers and single quantum dot devices. This not the first time the ancients have come to the rescue of nano-technology, a couple of years ago we had nano-menhirs. Several groups talked about improving LED’s through pyramids. A Samsung team grew... » read more

Uncommon Goals
By Atrenta - 14 Feb, 2013 - Comments: 0

I had the opportunity to attend the Common Platform event recently. This is a technology and business showcase sponsored by Global Foundries, IBM and Samsung with major support from ARM, Cadence, Synopsys and Mentor. Wow, that’s some serious sponsorship. The event was well run and provided a good balance of technology details and business outlook. The wine at the evening reception was decent ... » read more

Math Questions
By Ed Sperling - 08 Feb, 2013 - Comments: 0

The race is on. GlobalFoundries, TSMC, Samsung, IBM and Intel are all neck deep in research, test chips, variability, lithography and three-dimensional transistor designs. For the first time, though, the goal very publicly has shifted from performance and area to energy efficiency. Being able to double battery life with existing performance over the next couple nodes could mean smart phones ... » read more

Changes In The Supply Chain
By Ed Sperling - 31 Jan, 2013 - Comments: 0

Runaway complexity in design, implementation, verification and manufacturing is being mirrored across an increasingly complex supply chain. Now the question is what to do about it. Complexity is being driven by the continued shrinking of feature sizes and the clamor for more functionality to leverage the real estate that becomes available with each new process node. But the increased density... » read more

Supersizing Wafers
By Ed Sperling - 24 Jan, 2013 - Comments: 0

By Katherine Derbyshire Get ready for 450mm wafers. First seriously considered in 2005, these supersized wafers, along with the equipment to handle, measure, and process them, have gradually made their way to the top of the semiconductor industry’s priority list. But what exactly does that mean? What will 450mm fabs look like, and how will they differ from the 300-mm fabs being built toda... » read more

Stacked Die From A Networking Angle
By Mark LaPedus - 24 Jan, 2013 - Comments: 1

By Mark LaPedus The first wave of 2.5D chips using silicon interposers are trickling out in the marketplace.FPGA vendor Xilinx was the first chipmaker to ship a 2.5D device, and Altera, Cisco, Huawei and IBM recently have talked about their respective 2.5D chip developments. Generally, Altera and Xilinx have taken a somewhat identical and straightforward approach. The two companies are sepa... » read more

It’s Transition Time Again
By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ed Sperling After decades of shrinking features, developing new software on every level and engineering huge improvements in energy efficiency and performance, the semiconductor industry has reached a crossroads. To get to the next level will require massive improvements on all fronts, but not all consumers will be willing to pay for them. For example, if a battery lasts an entire day f... » read more

Foundry Landscape Changes In 3D
By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Over the last year, leading-edge silicon foundries announced their new and respective strategies in the emerging 2.5D/3D chip arena. The ink is barely dry and now the foundry landscape is changing. One new vendor, Tezzaron Semiconductor, is entering the market. The 3D DRAM supplier plans to provide select 2.5D/3D foundry services within its recently acquired fab in Austin, T... » read more

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