tag: semiconductor

Customization, Heterogenous Integration, And Brute Force Verification
By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

What Future Processors Will Look Like
By Ed Sperling - 13 Jul, 2022 - Comments: 0

Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Mixed Outlook For Silicon Wafers
By Mark LaPedus - 20 Jan, 2022 - Comments: 0

Silicon wafers are a fundamental part of the semiconductor business. Every chipmaker needs to buy them in one size or another, such as 200mm, 300mm and others. Silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So what’s in store for the silicon wafer market? Sungho Yoon, senior research manager at SEMI, sat down with Se... » read more

Covid Masks And Forecasts At Semicon
By Mark LaPedus - 16 Dec, 2021 - Comments: 0

Semicon West 2021 was certainty different, if not surreal, this year. The annual event was held in-person from Dec. 7-9, although there is a virtual component that runs until Jan. 7, 2022. In comparison, Semicon West was an all-virtual event in 2020, due to the Covid-19 pandemic. At this year’s in-person event in San Francisco, attendees, exhibitors and speakers were all required to wea... » read more

Reconstruction of Bloch wavefunctions of holes in a semiconductor
By Technical Paper Link - 07 Dec, 2021 - Comments: 0

Summary "A central goal of condensed-matter physics is to understand how the diverse electronic and optical properties of crystalline materials emerge from the wavelike motion of electrons through periodically arranged atoms. However, more than 90 years after Bloch derived the functional forms of electronic waves in crystals [1] (now known as Bloch wavefunctions), rapid scattering processes ha... » read more

High-Voltage, High-Current Electrical Switching Discharge Synthesis of ZnO Nanorods: A New Method toward Rapid and Highly Tunable Synthesis of Oxide Semiconductors in Open Air and Water for Optoelectronic Applications
By Technical Paper Link - 09 Nov, 2021 - Comments: 0

Abstract: "A novel method of oxide semiconductor nanoparticle synthesis is proposed based on high-voltage, high-current electrical switching discharge (HVHC-ESD). Through a subsecond discharge in the HVHC-ESD method, we successfully synthesized zinc oxide (ZnO) nanorods. Crystallography and optical and electrical analyses approve the high crystal-quality and outstanding optoelectronic charac... » read more

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

MXene-GaN van der Waals metal-semiconductor junctions for high performance multiple quantum well photodetectors
By Technical Paper Link - 12 Oct, 2021 - Comments: 0

Abstract: "A MXene-GaN-MXene based multiple quantum well photodetector was prepared on patterned sapphire substrate by facile drop casting. The use of MXene electrodes improves the responsivity and reduces dark current, compared with traditional Metal-Semiconductor-Metal (MSM) photodetectors using Cr/Au electrodes. Dark current of the device using MXene-GaN van der Waals junctions is reduced b... » read more

Plasma processing for advanced microelectronics beyond CMOS
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

N. Marchack, L. Buzi, D. B. Farmer, H. Miyazoe, J. M. Papalia, H. Yan, G. Totir, and S. U. Engelmann , "Plasma processing for advanced microelectronics beyond CMOS", Journal of Applied Physics 130, 080901 (2021) https://doi.org/10.1063/5.0053666 ABSTRACT "The scientific study of plasma discharges and their material interactions has been crucial to the development of semiconductor process en... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

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