Applying Machine Learning To Chips


The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

Merging Verification With Validation


Verification and validation are two important steps in the creations of electronic systems and over time their roles, but how they play together is changing. In fact, today we are seeing a major opportunity for rethinking this aspect of the flow, which could mean the end of them as separate tasks for many of the chips being created. As with many things in this industry, however, squeezing it... » read more

The PCB Engineer’s Guide To Successful DDR Bus Design


This paper tackles the critical signal integrity concerns encountered when designing, simulating, and analyzing DDR buses. The first section describes DDR bus design challenges that can be particularly problematic, even intimidating, to designers. Subsequent sections describe how simulation and analysis speed up the design of a functioning DDR system to reduce PCB spins and shorten the time to ... » read more

Blog Review: Mar. 21


Mentor's Colin Walls shares five more quick tips for embedded software programming, including t real time systems, programming philosophy, and C++ operator overloading. Cadence's Paul McLellan digs into recently released semiconductor company ratings, the role of memory in shaking up the list, and China's plans for more 3D NAND and DRAM fabs. Synopsys' Taylor Armerding examines the latest... » read more

EUV’s New Problem Areas


Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

The Week In Review: Design


Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

IIoT Security Threat Rising


The rapid growth of the Industrial Internet of Things is raising questions about just how secure these systems are today, how to improve security, and who exactly should be responsible for that. These issues are interlaced with a shift in where a growing volume of data gets processed, the cost and speed of moving large amounts of data, and the increasing frequency and cost of attacks. "Di... » read more

Blog Review: Mar. 14


Cadence's Meera Collier considers the issues of bias implementation in algorithms and AI systems, and whether immense training sets can really solve the problem. Mentor's Cristian Filip digs into the evolution of signal integrity analysis methods and why different data rates require different solutions. Synopsys' Naveen G explains key features introduced in the latest generation of interc... » read more

LiDAR Goes Back To The Future


LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Power Aware Intent And Structural Verification Of Low-Power Designs


Power aware static verification, more popularly known as PA-Static checks, is performed on designs that adopt certain power dissipation reduction techniques through the power intent or [gettech id="31044" t_name="UPF"]. The term static originates from verification tools and methodologies that applies a set of pre-defined power aware (PA) or multi-voltage (MV) rules based on the power requiremen... » read more

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