Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Saudi Arabia has launched an electric vehicle (EV) company called Ceer. The company is a joint venture between the Public Investment Fund (PIF) of Saudia Arabia and Foxconn (Hon Hai Precision Industry Co.). SiMa.ai, a four-year-old startup that designs edge machine learning SoCs used in vision applications, is getting into the automotive assisted driving market. The com... » read more

Week In Review: Design, Low Power


Tools and IP Scandinavian researchers used a laser-powered chip to transmit about 1.84 petabytes of data over a fiber optic cable in one second. The scientists said the technology could lead to faster broadband speeds and reduce the amount of energy used to keep the internet running. Imec said the semiconductor industry is likely to see increasing separation of power delivery and signal rou... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The BMW Group will invest $1.7 billion in its U.S. operations to build electric vehicles and batteries, mostly in South Carolina. BMW will drop $1 billion in its South Carolina plant for EV production and $700 million for a new battery-assembly facility in the state. BMW also agreed to purchase battery cells from Japan-based Envision AESC, which plans to construct a new ba... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Foundational Changes In Chip Architectures


We take many things in the semiconductor world for granted, but what if some of the decisions made decades ago are no longer viable or optimal? We saw a small example with finFETs, where the planar transistor would no longer scale. Today we are facing several bigger disruptions that will have much larger ripple effects. Technology often progresses in a linear fashion. Each step provides incr... » read more

Week in Review: Design, Low Power


Could power beams be the key to smart city infrastructure and 5G/6G connectivity? A new report says both lasers and microwaves offer possible paths forward in this area, though both technologies come with benefits and drawbacks. Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are desi... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges


The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Streamline DO-254 Compliance With Model-Based Design


By Eric Cigan, MathWorks, and Jacob Wiltgen, Siemens EDA The purpose of DO-254 (formally known as RTCA/ DO-254 or ED80) is to provide guidance for the development of airborne electronic hardware. The Federal Aviation Administration (FAA), European Aviation Safety Agency (EASA), and other worldwide aviation safety authorities require this standard to ensure that complex electronic hardware us... » read more

Blog Review: Oct. 5


Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

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