Partitioning Becomes More Difficult


The divide-and-conquer approach that has been the backbone of verification for decades is becoming more difficult at advanced nodes. There are more interactions from different blocks and features, more power domains, more physical effects to track, and far more complex design rules to follow. This helps explain why the number of tools required on each design—simulation, prototyping, em... » read more

Hidden Costs Of Shifting Left


The term "Shift Left" has been used increasingly within the semiconductor development flow to indicate tasks that were once performed sequentially must now be done concurrently. This is usually due to a tightening of dependences between tasks. One such example being talked about today is the need to perform hardware/software integration much earlier in the flow, rather than leaving it as a sequ... » read more

EDA In The Cloud


Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

Aging Models: The Basis For Predicting Circuit Reliability


Today, many products are based on high-performance electronic systems and integrated circuits (ICs), and the importance of these elements is ever-increasing. A certain tension arises here as these applications often call for a large amount of processing power and reliability. The processing power can best be supplied with highly scaled semiconductor technologies. However, these manufacturing te... » read more

Enhancing The Energy-Efficient Production of Tempered Glass By Using Simulation-Based Optimization


In many industrial manufacturing processes energy use is one of the most important cost factors. Especially in energy-intensive industries like steel production or glass processing minimizing energy use is a key measure to save resources and reduce manufacturing costs. The research project OptPlanEnergie concentrates on the production of tempered glass. In this project we apply simulation and o... » read more

Going Deep Or Broad With Formal?


Whether to apply [getkc id="33" comment="formal verification"] technology to semiconductor design broadly or deeply is a tough question. It hinges on what is the best way to achieve maximum ROI. Do you want to identify hard to find bugs, and get a certain level of confidence about a block? Where should the effort be placed? Is it by going deep, meaning a team of specialists or experts must b... » read more

Tech Talk: Faster Simulation


Cadence’s Adam Sherer talks about how to speed up simulation in complex multi-core designs. https://youtu.be/lDgMwU5KN7U » read more

Merging Verification With Validation


Verification and validation are two important steps in the creations of electronic systems and over time their roles, but how they play together is changing. In fact, today we are seeing a major opportunity for rethinking this aspect of the flow, which could mean the end of them as separate tasks for many of the chips being created. As with many things in this industry, however, squeezing it... » read more

The PCB Engineer’s Guide To Successful DDR Bus Design


This paper tackles the critical signal integrity concerns encountered when designing, simulating, and analyzing DDR buses. The first section describes DDR bus design challenges that can be particularly problematic, even intimidating, to designers. Subsequent sections describe how simulation and analysis speed up the design of a functioning DDR system to reduce PCB spins and shorten the time to ... » read more

The Next 5 Years Of Chip Technology


Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational litho products at ASML; and Shay... » read more

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