tag: STATS ChipPAC

Full Steam Ahead For China Inc.
By Joanne Itow - 19 Mar, 2015 - Comments: 1

Were you in Shanghai this week? If not, you missed the biggest Semicon event in the world. Semicon China broke records this year. With more than 1,000 companies participating, and 570,000 square meters of exhibition space, Semicon China attracted more than 50,000 visitors, making it the largest Semicon event in the world. All the sessions we attended were standing room only. Key areas of fo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Jan, 2015 - Comments: 0

China’s ambitious plan in the 1990s to create numerous foundries did not come to fruition. But in 2014, the Chinese government described new semiconductor industry programs that will utilize investments by both the Chinese national government ($19.5 billion) and local government and private equity investors ($97.4 billion). “IC Insights believes that these outlays have the potential to sign... » read more

Is The Stacked Die Ecosystem Stagnating?
By Ann Mutschler - 18 Dec, 2014 - Comments: 2

It is now widely agreed that not much has been happening in terms of adoption for 2.5D interposer and 3D ICs. “It seems like everyone is still at the starting line waiting for the race to begin," said Javier DeLaCruz, senior director of engineering of [getentity id="22242" e_name="eSilicon"]. "Interposer assembly and IP availability for effectively using the [getkc id="82" comment="2.5D IC... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Nov, 2014 - Comments: 0

China’s Jiangsu Changjiang Electronics Technology (JCET) has made a bid to acquire STATS ChipPAC for $780 million, according to reports. This year’s top-20 chip ranking includes two pure-play foundries--TSMC and UMC--and six fabless companies, according to IC Insights. GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia, according to t... » read more

Making Chips Run Faster
By Ed Sperling - 11 Sep, 2014 - Comments: 3

For all the talk about low power, the real focus of most chipmakers is still performance. The reality is that OEMs might be willing to sacrifice increasing performance for longer battery life, but they will rarely lower performance to reach that goal. This is more obvious for some applications than others. A machine monitor probably isn’t the place where performance will make much of a dif... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Sep, 2014 - Comments: 0

Tesla Motors plans to build a new 35-GWh, lithium-ion cell production facility for its electric vehicles. It sounds like a good idea. But the factory will bring about only a modest reduction in battery costs, and could create significant overcapacity in the arena, according to Lux Research. “The Gigafactory will only reduce the Tesla Model 3’s cost by $2,800, not enough to sway the success ... » read more

IoT Growing Pains
By Ed Sperling - 04 Sep, 2014 - Comments: 0

The Internet of Things is having one of those defining moments — and not in a good way. Only a limited number of things will work together at first. Only in rare case will they actually cross boundaries between vertical markets such as consumer or home, automotive and medical. And in no cases will there be any guarantees, at least in the short term, that communications will be reliable, secur... » read more

Ready To Pounce
By Ed Sperling - 21 Aug, 2014 - Comments: 0

A series of inflection points at 16/14nm and beyond is having a rather unusual effect on the semiconductor industry. Rather than forge ahead with the next nodes to gain an edge and early lead over rivals—the standard formula for success over the past five decades—the entire supply chain is poised on the edge, waiting for someone to make the first move before they take action. The problem... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Aug, 2014 - Comments: 0

Many are suffering from “fragiphoniphobia” without even realizing it, according to Kyocera. This is the fear of fragile phones and worries about the drops and spills ruining our smartphones and disrupting our lives. A recent survey from comScore revealed that 73% of consumers surveyed rated drop protection or scratch-proof/shatter-proof screens as the most desirable durability feature, whil... » read more

Mobile Packaging Market Heats Up
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to cram more chip functions in smaller IC packages, but there are some challenges in the arena. In fact, there are signs that the mainstream packaging technology for mobiles is running out of steam. For some time, mobile products have incorporated a technology called package-on-package (PoP), which u... » read more

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