tag: Synopsys

Blog Review: June 28
By Jesse Allen - 28 Jun, 2017 - Comments: 0

Mentor's Craig Armenti notes the benefits, and challenges, of investing in modular design in the PCB domain. Cadence's Paul McLellan covers a DAC chat with CEO Lip-Bu Tan on the rise of advanced packaging and investments in AI and autonomous driving. Synopsys' Jim Hartnett examines some of the challenges and tradeoffs involved in building good security practices in hospital environments. ... » read more

Safety Plus Security: Solutions And Methodologies
By Ed Sperling - 26 Jun, 2017 - Comments: 0

By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

The Week In Review: Design
By Jesse Allen - 23 Jun, 2017 - Comments: 0

M&A Silvaco will acquire SoC Solutions, adding more IP experience to the company's portfolio. SoC Solutions, based in Atlanta, GA, focuses on pre-configured IP subsystems and IP targeting low power IoT and machine-to-machine communication. Terms of the deal were not disclosed, but the acquisition is expected to close soon. Imagination is putting the rest of the company up for sale after... » read more

Verification Unification
By Brian Bailey - 22 Jun, 2017 - Comments: 0

Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Blog Review: June 21
By Jesse Allen - 21 Jun, 2017 - Comments: 0

Mentor's John McMillan looks into the unique form-factors and components influencing IoT PCB designs. Cadence's Paul McLellan notes some big topics at the Samsung Foundry Forum: FD-SOI, embedded MRAM, and which gate-all-around FET architecture may be the winner. Synopsys' Eric Huang has a lighthearted look at why to buy IP versus building it. Rambus' Aharon Etengoff points to another U... » read more

Monday At DAC
By Brian Bailey - 20 Jun, 2017 - Comments: 1

The 54th DAC got started today in a very steamy Austin. While we may be a maturing industry, there is certainly no indications that the people within the industry have given up or intend to take it easy. The event really got started late Sunday when Laurie Balch, chief analyst for Gary Smith EDA, delivered her message. She said that the focus is becoming the verticals. "This change in focus is ... » read more

Shrink Or Package?
By Ed Sperling - 19 Jun, 2017 - Comments: 0

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

The Week In Review: IoT
By Jeff Dorsch - 16 Jun, 2017 - Comments: 0

Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

Going Vertical?
By Debra Vogler - 15 Jun, 2017 - Comments: 0

The topic of transistor scaling has been traditionally covered at SEMICON West in its own right. This year’s event, however, will also explore scaling in 3D, as well as using packaging to accomplish similar objectives. Along with traditional transistor scaling, speakers will tackle design and metrology considerations for scaling the package, and address the economic decisions that inform dens... » read more

Blog Review: June 14
By Jesse Allen - 14 Jun, 2017 - Comments: 0

In a video, Cadence's Tom Hackett looks at the evolving von Neumann computer architecture and the development of CCIX driven by recent cloud computing challenges. Mentor's Puneet Sinha notes it's been 17 years since the Toyota Prius went on sale worldwide, and looks ahead to the next 17 years of electric vehicles. Synopsys' Sri Deepti Pisipati gives an overview of the different topologies... » read more

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