tag: TSMC

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Dec, 2017 - Comments: 0

Fab tools and test Four former employees at Applied Materials were charged by the U.S. for allegedly trying to steal the company’s own fab tool technology designs, according to a report from Bloomberg and others. The former employees were allegedly trying to sell the technology to a Chinese startup that would compete against Applied, according to the report. The former employees--Liang C... » read more

Manufacturing Bits: Dec. 5
By Mark LaPedus - 05 Dec, 2017 - Comments: 3

Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Dec, 2017 - Comments: 0

Chipmakers The 2017 top-ten rankings of foundries remain the same as last year, according to TrendForce. TSMC, GlobalFoundries and United Microelectronics Corp. (UMC) rank first, second, and third, respectively, in terms of projected sales in 2017, according to TrendForce. TSMC has a dominant market share of 55.9%. In the rankings, Samsung is in fourth place, followed in order by SMIC, TowerJa... » read more

More Volatility Ahead
By Ed Sperling - 30 Nov, 2017 - Comments: 0

The entire semiconductor industry had a wild ride on the stock market this week, plunging on Wednesday and recovering on Thursday. This is just a sign of things to come. The cause of this week's volatility can be tied directly to a Morgan Stanley report, which said that NAND prices have peaked and will begin dropping at the beginning of 2018 because supply has caught up with demand. The repo... » read more

Five Trends In IC Packaging
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

Variation Spreads At 10/7nm
By Ed Sperling - 16 Nov, 2017 - Comments: 6

Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But some of that is actually due to variations in equipment—sometimes the exact same model from the same vendor. Normally this would fall well below the radar of the semiconductor industry. But as t... » read more

What’s Next For Atomic Layer Etch?
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

How To Build A Trillion Connected Things
By Rob Aitken - 23 Oct, 2017 - Comments: 0

A trillion is a big number. A broadcaster reads about 1,000 words in a five-minute newscast. At that rate, it would take 6,000 years at that rate to finish a trillion-word newscast. We’re on a path in the technology industry to build and connect a trillion devices in the coming years. How are we going to do that, given the scale and sheer size of the task? Is it achievable in the time f... » read more

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