tag: Tulane University

Security Research: Technical Paper Round-up
By Linda Christensen - 29 Aug, 2023 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Hardware-Assisted Malware Analysis
By Technical Paper Link - 25 Aug, 2023 - Comments: 0

A technical paper titled "On the Feasibility of Malware Unpacking via Hardware-assisted Loop Profiling" was published by researches at Shandong University & Hubei Normal University, Tulane University and University of Texas at Arlington.  This paper was included at the recent 32nd USENIX Security Symposium. Abstract "Hardware Performance Counters (HPCs) are built-in registers of modern... » read more

Manufacturing Bits: Aug. 1
By Mark LaPedus - 01 Aug, 2017 - Comments: 0

Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

System Bits: Nov. 1
By Ann Mutschler - 01 Nov, 2016 - Comments: 0

There is a lurking malice in cloud hosting services A team of researchers from the Georgia Institute of Technology, Indiana University Bloomington, and the University of California Santa Barbara has found — as part of a study of 20 major cloud hosting services — that as many as 10 percent of the repositories hosted by them had been compromised, with several hundred of the ‘buckets’ act... » read more

Advanced Packaging Options, Issues
By Ed Sperling - 23 Jun, 2016 - Comments: 0

Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

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