Week In Review: Auto, Security, Pervasive Computing


The U.S. Cybersecurity and Infrastructure Security Agency (CISA) issued a cybersecurity warning about Chinese state-sponsored activity impacting networks across U.S. critical infrastructure. “One of the actor’s primary tactics, techniques, and procedures (TTPs) is living off the land, which uses built-in network administration tools to perform their objectives," the agency said. Hacking eff... » read more

Rethinking Engineering Education In The U.S.


The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Microarchitectural Side-Channel Attacks And Defenses On Non-Volatile RAM


A new technical paper titled "NVLeak: Off-Chip Side-Channel Attacks via Non-Volatile Memory Systems" was written (preprint) by researchers at UC San Diego, UT Austin, and Purdue University. Abstract "We study microarchitectural side-channel attacks and defenses on non-volatile RAM (NVRAM) DIMMs. In this study, we first perform reverse-engineering of NVRAMs as implemented by the Intel Optane... » read more

Week In Review: Design, Low Power


Top Of The News Google announced it will support the RISC-V architecture with the Android open-source operating system. In a keynote at the RISC-V Summit, Lars Bergstrom, Google's director of engineering for the Android Platform Programming Languages, noted that Android currently has more than 3 billion users and the support of more than 24,000 vendors. "We've been following RISC-V for a very ... » read more

The Next Incarnation Of EDA


The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

What’s Missing For Designing Chips At The System Level


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Building Complex Chips That Last Longer


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

The Chip Industry’s Next-Gen Roadmap


Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Hidden Costs In Faster, Low-Power AI Systems


Chipmakers are building orders of magnitude better performance and energy efficiency into smart devices, but to achieve those goals they also are making tradeoffs that will have far-reaching, long-lasting, and in some cases unknown impacts. Much of this activity is a direct result of pushing intelligence out to the edge, where it is needed to process, sort, and manage massive increases in da... » read more

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