Chip Industry Technical Paper Roundup: Dec 30


New technical papers recently added to Semiconductor Engineering’s library: [table id=509 /] Find more semiconductor research papers here. » read more

Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)


A new technical paper titled "3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems" was published by researchers at EPFL and Universidad Complutense de Madrid. Abstract "The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps w... » read more

System Bits: Dec. 15


Building chips skyscraper style With the aim of boosting electronic performance by factor of a thousand, a team of researchers led by Stanford University engineers have created a skyscraper-like chip design, based on materials more advanced than silicon. For many years, computer systems have been designed with processors and memory chips laid out like single-story structures in a suburb whe... » read more