tag: yieldWerx

Hybrid Approach Emerges For Edge/Cloud Inspection Of Chips
By Anne Meixner - 14 Oct, 2025 - Comments: 0

An explosion in data from inspection images and metrology measurements is creating a confusing set of demands for chipmakers and their equipment vendors. On one hand they need the massive storage and compute resources of the cloud to utilize AI/ML-based models, but they also need the faster response time of the edge to make adjustments at the tool level. Balancing these requirements is a mas... » read more

Precision Under Pressure: Managing Materials Complexity In Advanced Packaging
By Gregory Haley - 18 Sep, 2025 - Comments: 0

In the race to extend Moore's Law through advanced packaging, the limits of precision are no longer defined solely by lithography. Increasingly, they are dictated by the unpredictable behavior of materials. Semiconductor packaging today is no longer limited to just silicon and copper. It includes an expanding range of polymers, adhesives, dielectrics, exotic metals, along with substrates suc... » read more

Correlation & Commonality Analysis In Complex Semiconductor Ecosystems
By Aftkhar Aslam - 18 Sep, 2025 - Comments: 0

The semiconductor industry is entering an era defined by heterogeneous integration and complex packaging technologies. Innovations such as wafer-on-wafer bonding, chiplets, multi-stacked die (2.5D/3D), bumping, and system-in-package architectures are enabling unprecedented performance and functionality. However, with these advances comes an explosion in manufacturing complexity and ecosy... » read more

Making The Most of Test Resources
By Laura Peters - 09 Sep, 2025 - Comments: 0

Semiconductor testing is undergoing multiple paradigm changes at once with the common goals of producing more known good die per month with low test cost. Achieving these goals requires a delicate balance between yield, quality, and test times. There are multiple ways to go about making better use of existing resources, many of which involve an increasing use of design for test (DFT) methods... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

Advanced Part Average Testing For Chips
By Ed Sperling - 26 Aug, 2025 - Comments: 0

Part average testing, one of the mainstays of semiconductor test, is becoming much more challenging at advanced nodes and in multi-die assemblies. In the past, PAT produced a Gaussian distribution that made it relatively simple to find outliers. That's no longer the case. Advanced packaging and leading-edge designs have unique attributes that determine which rules apply, such as the thickness o... » read more

Manufacturing At The Limits
By Gregory Haley - 21 Aug, 2025 - Comments: 2

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of overlay variation, modest differences in wafer bow, and particle sizes rivaling the interconnect height without catastrophic impact. Hybrid bonding is compatible with optical metrology, existing ... » read more

Advancing Outlier And Quality Control Methodologies
By yieldWerx - 04 Aug, 2025 - Comments: 0

Traditional outlier and quality control methodologies often assume that data will conform to ideal, Gaussian distributions. In practice, this is rarely the case. Upstream variability in manufacturing—ranging from process variation to equipment inconsistencies—can significantly impact the behavior of otherwise good die. Identifying subtle yield detractors requires examining a broader set of ... » read more

The Race To Replace Silicon
By M. Rameez Arif - 24 Jul, 2025 - Comments: 1

For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

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