Neuromorphic Artificial Synaptic Device Combining Memristor Arrays With Copper Iodide
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Charge-Mediated Copper-Iodide-Based Artificial Synaptic Device with Ultrahigh Neuromorphic Efficacy” was published by researchers at University of Glasgow, City University of Hong Kong, and Hong Kong Metropolitan University. Abstract: "In the realm of artificial intelligence, ultrahigh-performance neuromorphic computing plays a significant role in executing multi... » read more

A Perovskite-Derivative Nickelate Offering More Durable, Sustainable Multi-Level Non-Volatile Phase Change Memory
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Thermally Reentrant Crystalline Phase Change in Perovskite-Derivative Nickelate Enabling Reversible Switching of Room-Temperature Electrical Resistivity” was published by researchers at Tohoku University and University of Tsukuba. Abstract: "Reversible switching of room-temperature electrical resistivity due to crystal-amorphous transition is demonstrated in vari... » read more

Electro-Thermal Design Breakthrough
By Siemens EDA - 13 Sep, 2023 - Comments: 0

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Understanding UVM Coverage For RISC-V Processor Designs
By Synopsys - 13 Sep, 2023 - Comments: 0

Attempting to achieve complete RISC-V verification requires multiple methodologies employing a wide range of relevant tools, including: • Coverage driven simulation based on UVM constrained random methods and compliant with the Universal Verification Methodology (UVM) standard • Static and formal property verification • Equivalence checking • Emulation and FPGA based verific... » read more

The Ansys Charge Plus PiC Solve
By Ansys - 13 Sep, 2023 - Comments: 0

All surfaces are exposed to radiation, whether aircraft fuselages, satellite skins, or solar panels, are subjected to ionization effects through the accumulation of charged plasmas. Such plasmas present critical hazards to these platforms as their sudden nonlinear discharges can damage or destroy surfaces and underlying electronic components. Through the Particle-in-Cell solver, Ansys Charge Pl... » read more

Arm Total Compute: Engineering For Tomorrow’s Workload
By Arm - 13 Sep, 2023 - Comments: 0

As consumers seek richer and more immersive experiences from their devices, the way compute systems are engineered must continually evolve to keep up. Arm Total Compute takes a solution-focused approach to system-on-chip design, moving beyond individual IP elements to design and optimize the system as a whole to enable more digital immersion experiences. Not only does this white paper dis... » read more

Blog Review: September 13
By Jesse Allen - 13 Sep, 2023 - Comments: 0

Siemens' Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem. Synopsys' Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center shou... » read more

Startup Funding: August 2023
By Jesse Allen - 13 Sep, 2023 - Comments: 0

August startup funding continued to follow the trends that put AI and autonomous driving at the top of funding. One of August's largest rounds went to a company designing AI processor IP that can scale from the edge to the cloud. Plus, three battery manufacturers brought in one billion dollars or more. This report covers 37 companies that collectively raised $4.2 billion in August 2023. [... » read more

Fab And Field Data Transforming Manufacturing Processes
By Gregory Haley - 12 Sep, 2023 - Comments: 0

The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product's performance in real-time and under real-world conditions and use cases. Historically, data that encapsulates parameters such as power consumption, temperature, voltages, currents, timing, and other characteristics, was confined to d... » read more

Customizing IC Test To Improve Yield And Reliability
By Ed Sperling - 12 Sep, 2023 - Comments: 0

Testing the performance and power of semiconductors as they come off the production line is beginning to shift left in the fab, reversing a long-standing trend of assessing chips just prior to shipping. While this may sound straightforward, it's a difficult challenge which, if successful, will have broad implications for the entire design-through-manufacturing flow. Manufacturers typically g... » read more

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