category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Concurrent Test
By Ed Sperling - 11 Jan, 2019 - Comments: 0

Derek Wu, senior staff applications engineer at Advantest, looks at the need for doing multiple tests at the same time as chip designs become more complex, increasingly heterogeneous, and much more difficult to test at advanced nodes. https://youtu.be/-8inbjX_af0       __________________________________ See more tech talk videos here. » read more

AI In Chip Manufacturing
By Ed Sperling - 10 Jan, 2019 - Comments: 0

Ira Leventhal, New Concept Product Initiative vice president at Advantest, talks with Semiconductor Engineering about using analysis and deep learning to make test more efficient and more effective. https://youtu.be/3VVG4JVnjHo » read more

Quantum Issues And Progress
By Katherine Derbyshire - 07 Jan, 2019 - Comments: 3

Quantum computing is showing significant promise, and research is beginning to move from the earliest stages to a deeper understanding of what works best commercially and why. On paper, quantum computing algorithms are potentially revolutionary. They suggest a way to solve some problems more quickly and more accurately than conventional computers ever could. But out in the real world of prac... » read more

4 Issues In Test
By Ed Sperling - 10 Dec, 2018 - Comments: 0

When most design engineers think about test, they envision a large piece of equipment in the fab they probably will never actually see or interact with. But as chips become more complex—driven by an explosion in both quantity and different types of data—test is emerging as one of the big challenges in design and manufacturing. There are four primary segments for test, each with its own s... » read more

Food for Thought
By Judy Davies - 10 Dec, 2018 - Comments: 0

Eating healthy, getting plenty of rest and exercising regularly are the main ingredients in the recipe for wellness and fitness. But with today’s hectic lifestyles and hurried pace, do most of us still meet these basic requisites? Over the years, multiple programs have been launched to optimize the nutritional content of the foods we eat. Since the early 1900s, breakfast cereals have been ... » read more

Peak Signal-To-Noise Ratio As An Image Quality Metric
By NI - 10 Dec, 2018 - Comments: 0

The term peak signal-to-noise ratio (PSNR) is an expression for the ratio between the maximum possible value (power) of a signal and the power of distorting noise that affects the quality of its representation. Because many signals have a very wide dynamic range, (ratio between the largest and smallest possible values of a changeable quantity) the PSNR is usually expressed in terms of the logar... » read more

A Longer Life For LED Power Electronics
By DELTA, a part of FORCE Technology - 10 Dec, 2018 - Comments: 0

One of the greater challenges with LED lighting is the electronic driver’s robustness to normally occurring transients or power surges in the network. Many everyday examples have shown that the active electronics in the light sources find it hard to handle the effects in a use environment, in which incandescent bulbs and lamps with passive electronics have functioned fine for decades. A new p... » read more

The Growing Promise Of Printed Electronics
By Ed Sperling - 10 Dec, 2018 - Comments: 1

Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize this technology across a broad range of sensor applications. Unlike traditional semiconductors, which use tiny wires as circuits, printed electronics rely on conductive inks and often flexible films, although they can be printed ... » read more

Cost Analysis of a Wet Etch TSV Reveal Process
By Veeco - 10 Dec, 2018 - Comments: 0

Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is a need to refine and optimize the TSV reveal process to red... » read more

Planarization Challenges At 7nm And Beyond
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

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