category: System-Level Design

category: Auto, Security & Edge AI

Blog Review: Oct. 15
By Ed Sperling - 15 Oct, 2014 - Comments: 0

Obesity makes your liver age faster, but you'll need a sophisticated biological clock to see that. Ansys' Bill Vandermark uncovers the top 5 engineering articles of the week. This one includes cyborg horses and an implanted prosthetic arm. Mentor's Colin Walls takes a look at "hard" and "soft" real time. It sounds like something out of a Salvador Dali painting. Rambus' Aharon Etengoff t... » read more

High-Level Gaps Emerge
By Ann Mutschler - 15 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow with Bernard Murphy, CTO at [getentity id="22026" e_name="Atrenta"]; Leah Clark, associate technical director for digital video technology at Broadcom; Phil Bishop, vice president of the system level design system & verification group at [getentity id="22032" e_name="Cadence"]; and Jon McDon... » read more

System Bits: Oct. 14
By Ann Mutschler - 14 Oct, 2014 - Comments: 0

Exotic states of light and matter In research that merges two areas that have only been studied separately, ETH researchers are studying solid-state physics and quantum optics as a potential first step toward quantum computing. Specifically, the physicists are looking between tiny mirrors to a special layer of the semiconductor material gallium arsenide, prepared in such a way that the elec... » read more

Who Really Invented The Blue LED?
By Ed Sperling - 10 Oct, 2014 - Comments: 5

A dispute is simmering in the materials science community over the just-announced award of Nobel Prize in physics to three Japanese scientists, Isamu Akasaki, Hiroshi Amano, and Shuji Nakamura. Two materials science Ph.D. students from Stanford claim they got there first—two decades earlier, in fact. There's even a U.S. patent filed by Stanford University to prove it. Akasaki and Amano wor... » read more

Welcome To The Knowledge Center
By Jesse Allen - 10 Oct, 2014 - Comments: 0

The Knowledge Center is a new feature you may have seen popping up in articles over the past few weeks. This has been a large development project for Semiconductor Engineering that started early in 2014. It is a ground-up development and it is amazing how far we have come in that time. Expect to hear more about this from our editorial team in the next few weeks. Just a few stats to get us st... » read more

The Week In Review: Design
By Ed Sperling - 10 Oct, 2014 - Comments: 0

IP Synopsys rolled out verification IP for mobile PCIe, including built-in M-PHY, for UVM environments. Cadence introduced MIPI SoundWire controller IP, which allows bi-directional digital communication using low gate count and minimal complexity. Deals ARM and TSMC rolled out a road map for 64-bit ARM-based processors at 10nm. The companies said the early pathfinding work is expected t... » read more

Blog Review: Oct. 8
By Ed Sperling - 08 Oct, 2014 - Comments: 0

Mentor's Robin Bornoff examines the thickness of leg hair and just how much of a drag it causes for bicyclists. More hair equals more drag, and thicker hair is worse. Ansys' Justin Nescott routes out the top five engineering articles of the week. Of particular note: The world's most precise clock, which loses one second every 13.8 billion years. Cadence's Richard Goering puts some conte... » read more

System Bits: Oct. 7
By Ann Mutschler - 07 Oct, 2014 - Comments: 0

Towards spin-based computing It’s a given that semiconductors process electrical information, while magnetic materials enable long-term data storage. Along these lines, researchers from the University of Pittsburgh and the University of Wisconsin-Madison have discovered a way to fuse these two distinct properties in a single material that they believe could pave the way for new ultrahigh den... » read more

High-Level Gaps Emerge
By Ann Mutschler - 06 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow, and why it is needed at present with Leah Clark, associate technical director for digital video technology at [getentity id="22649" e_name="Broadcom"]; Jon McDonald, technical marketing engineer at [getentity id="22017" e_name="Mentor Graphics"]; Phil Bishop, vice president of the System Level D... » read more

Multi-Die Packaging Gains Steam
By Si2 - 06 Oct, 2014 - Comments: 0

By Herb Reiter Many readers will be familiar with my extensive background and focus in the emerging field of 3D IC technology, including both 3D stacked die and 2.5 interposer design flows. Now, I am excited to bring my expertise and passion to Silicon Integration Initiative (Si2), where I am now Director of 3D Programs, helping Si2’s members in the Open3D Technical Advisory Board develop pr... » read more

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