category: Technical Papers

category: Auto, Security & Edge AI

Review on Driving Circuits for Wide-Bandgap Semiconductor Switching Devices for Mid- to High-Power Applications
By Technical Paper Link - 04 Feb, 2022 - Comments: 0

Abstract: "Wide-bandgap (WBG) material-based switching devices such as gallium nitride (GaN) high electron mobility transistors (HEMTs) and silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) are considered very promising candidates for replacing conventional silicon (Si) MOSFETs for various advanced power conversion applications, mainly because of their capabi... » read more

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities
By Technical Paper Link - 04 Feb, 2022 - Comments: 0

Abstract: "Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing a... » read more

Comprehensive Model of Electron Conduction in Oxide-Based Memristive Devices
By Technical Paper Link - 03 Feb, 2022 - Comments: 0

Abstract "Memristive devices are two-terminal devices that can change their resistance state upon application of appropriate voltage stimuli. The resistance can be tuned over a wide resistance range enabling applications such as multibit data storage or analog computing-in-memory concepts. One of the most promising classes of memristive devices is based on the valence change mechanism in oxide... » read more

Electro-optic spatial light modulator from an engineered organic layer
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Tailored nanostructures provide at-will control over the properties of light, with applications in imaging and spectroscopy. Active photonics can further open new avenues in remote monitoring, virtual or augmented reality and time-resolved sensing. Nanomaterials with χ(2) nonlinearities achieve highest switching speeds. Current demonstrations typically require a trade-off: they eith... » read more

Inverse Design of Inflatable Soft Membranes Through Machine Learning
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Across fields of science, researchers have increasingly focused on designing soft devices that can shape-morph to achieve functionality. However, identifying a rest shape that leads to a target 3D shape upon actuation is a non-trivial task that involves inverse design capabilities. In this study, a simple and efficient platform is presented to design pre-programmed 3D shapes starting... » read more

Metasurface Colloidal Quantum Dot Photodetectors
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract: "Efficient photodetectors that can be easily engineered for a specific spectral window are of high interest. Here, we report on the design, fabrication, and characterization of metasurface-enhanced photodetectors and photodiodes using colloidal quantum dots. We fabricate photoconductors optimized for the wavelength range around 1550 nm featuring responsivities of up to 8000 A/W wit... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems
By Technical Paper Link - 21 Jan, 2022 - Comments: 0

Abstract: "Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board ... » read more

X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices
By Technical Paper Link - 21 Jan, 2022 - Comments: 0

Abstract: "X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an incre... » read more

Screen Printed Chipless RFID Tags on Packaging Substrates
By Technical Paper Link - 20 Jan, 2022 - Comments: 0

Abstract: "A chipless radio frequency identification (RFID) tag is a suitable low-cost alternative to any chip-based RFID one. The flexibility to use low-cost printing techniques makes chipless RFID a competitive technology. In this paper, we report an evaluation of the microwave performance of two different screen-printed chipless tags in the 3–6 GHz range. The tags were designed and scre... » read more

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