Low-Power And RF Design Heighten Signal-Integrity Concerns


By Ellen Konieczny As active devices and interconnect wires shrink and are placed closer together with the march of Moore’s Law, signal integrity is becoming a huge concern. If it is not maintained, a design’s future may be marred by lower yields, unreliable performance, and failure to work efficiently—if at all. For low-power and radio-frequency (RF) designs, which are being prod... » read more

Listening In With Better Audio


By Pallab Chatterjee The high profile discussion on new consumer products has been high definition-video and high-definition TV broadcast. The other end of the experience is starting to catch up with improved audio. Since the shift from LPs and CDs has taken place towards downloadable portable audio data, there have been complaints from the listeners about the quality of the sound. The f... » read more

Should Sign-Off And Implementation Be Separate Tools?


By Ann Steffora Mutschler In the last stages of design, how data is readied for manufacturing used to be relatively straightforward. Point tools were used to implement the design via a place and route tool then the design was “signed off” with physical verification software. Sign-off is the gate the design goes through before it can go into manufacturing. The design must meet the qua... » read more

Remaking The Design Landscape


By Ed Sperling Every now and then a new trend comes along in the semiconductor design world, often because an old tool doesn’t work well anymore or because a new one is achieving critical mass. Lithography moved to immersion when the wavelength couldn’t be refracted far enough anymore. Designers at the advanced end of Moore’s Law began using tools like high-level synthesis and Transa... » read more

Slow Start To Software-As-A-Service


By Pallab Chatterjee Can software as a service (SaaS) really work in the SoC design tools world? While many of the large EDA vendors continue to experiment with it, the future of this model isn’t especially promising. This is contrary to the overall trend among big software makers, which even in the large enterprise applications space are finding success with SaaS and the related cl... » read more

Stacked Dies Gain Attention, But So Far Little Traction


By Ed Sperling For the better part of two decades there has been a steady stream of predictions about the abrupt end of Moore’s Law, but it now appears the formula for doubling the number of transistors on a die every couple years will simply dissipate rather than fall off a cliff. While companies such as Intel and IBM continue to develop road maps that extend their road maps all the wa... » read more

Making DFM Work Better


By Ann Steffora Mutschler At 65nm, design for manufacturing optimization and analysis has mostly been an afterthought. At 40nm and beyond, DFM has been pushed well up into the design phase. There are good reasons for this shift. What emerged at the 65nm node were signoff tools that understand manufacturing used in semiconductor design, said Manoj Chako, a product director for digital si... » read more

More Choices But Less Design Freedom


By Ed Sperling “What if” is an indelible part of the lexicon of every SoC architect and design engineer from the front end of the design flow all the way to manufacturing, but while the terminology will persist for years to come the answers and the value of those answers are starting to change. Complexity, cost and the need for better integration have simultaneously increased the numb... » read more

Methodology Shifts Ahead


By Pallab Chatterjee The high cost of SoC development at advanced process nodes is forcing a significant shift in many of the methodologies used in design. Hierarchical design methods are giving way to IP integration and hierarchical analysis at the architectural and functional design levels. Previously, large blocks were implemented at the top level of the chip and the analysis was pushe... » read more

Return Of The Femtocell


By Cheryl Ajluni Nothing has been left unscathed in the current global economic downturn, and that includes femtocell deployments. It was just last year that femtocells were being proclaimed a 2009 “killer app,” along with LTE and WiMAX. But what was once viewed as the next great thing has instead faced a tough road with more than a few large-scale deployments by major mobile operators be... » read more

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