category: Top Stories

category: Auto, Security & Edge AI

A Crisis In DoD’s Trusted Foundry Program?
By Mark LaPedus - 22 Oct, 2018 - Comments: 0

The U.S. Department of Defense’s Trusted Foundry program is in flux due to GlobalFoundries’ recent decision to put 7nm on hold, raising national security concerns across the U.S. defense community. U.S. DoD and military/aerospace chip customers currently have access to U.S.-based “secure” foundry capacity down to 14nm, but that's where it ends. No other foundries provide similar “s... » read more

Wanted: Mask Equipment for Mature Nodes
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

Can Graphene Be Mass Manufactured?
By Katherine Derbyshire - 18 Oct, 2018 - Comments: 3

Since the isolation of graphene in 2004, the high mobility and unique transport properties of 2-dimensional semiconductors have tantalized physicists and materials scientists. Their in-plane carrier transport and lack of dangling bonds potentially can minimize line/edge scattering and other effects of extreme scaling. While 2-D materials cannot compete with silicon at current device dime... » read more

Machine Learning Invades IC Production
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

The Building Blocks Of Future Compute
By Ann Mutschler - 17 Oct, 2018 - Comments: 1

Eric Hennenhoefer, vice president of research at Arm, sat down with Semiconductor Engineering to talk about privacy, security, high-performance computing, accelerators, and Arm’s research. What follows are excerpts of that conversation. SE: Privacy, cybersecurity, silicon photonics, quantum computing are all hot topics today. What do you find really interesting with these emerging areas? ... » read more

FAA Traffic Management Anticipates Flying Cars
By Kevin Fogarty - 17 Oct, 2018 - Comments: 0

It may be a year or more before the U.S. Federal Aviation Administration (FAA) changes its rules enough for Amazon or other hopefuls to deliver products by drones. But the five-year FAA Reauthorization Act of 2018, signed into law Oct. 5, confirmed controversial rules the FAA considers critical to its ability to regulate drone traffic and confirmed funding and plans for drone-specific additi... » read more

RISC-V: More Than a Core
By Brian Bailey - 15 Oct, 2018 - Comments: 2

The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

Power Delivery Affecting Performance At 7nm
By Brian Bailey - 11 Oct, 2018 - Comments: 4

Complex interactions and dependencies at 7nm and beyond can create unexpected performance drops in chips that cannot always be caught by signoff tools. This isn't for lack of effort. The amount of time spent trying to determine if an advanced-node chip will work after it is fabricated has been rising steadily for several process nodes. Additional design rules handle everything from variation... » read more

Power Issues Grow For Cloud Chips
By Ann Mutschler - 11 Oct, 2018 - Comments: 0

Performance levels in traditional or hyperscale data centers are being limited by power and heat caused by an increasing number of processors, memory, disk and operating systems within servers. The problem is so complex and intertwined, though, that solving it requires a series of steps that hopefully add up to a significant reduction across a system. But at 7nm and below, predicting exactly... » read more

Reliability, Machine Learning And Advanced Packaging
By Ed Sperling - 11 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

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