Chiplet Interfaces Embrace Failures


Redundancy in chiplet interfaces is now a prerequisite for achieving sufficient yield in high-performance computing devices, which today are packed with tens of thousands of interconnects. And as the number and density of those interconnects increases, the prospects for yield only worsen. For more than two decades, high-speed I/O interfaces have included reliability strategies to manage in-f... » read more

AI Drives More Realistic Gaming


Video games are utilizing artificial intelligence to create increasingly realistic scenarios and interactions, enabled by big increases in processing horsepower and memory, and significantly faster data movement. GPUs, once confined to graphics rendering, are now also being deployed across a wide range of AI tasks, generating more realistic non-player characters, dynamic worlds, personalized... » read more

Agentic AI: Lots Of Little Black Boxes


AI is changing so quickly that it's not always clear how much of a security threat it poses for semiconductor design, and that uncertainty increases as AI agents are introduced into the mix. So far, the use of AI in chip design has been highly targeted. Most of what is included in design tools is some version of machine learning, bounded by tight control loops. EDA and IP vendors, large chip... » read more

SDVs And AI Forcing Big Changes In Automotive


The automotive industry is undergoing a fundamental transformation that includes everything from software-defined vehicles, the injection of AI into nearly every facet of the design and use case of a vehicle, and a complete overhaul of traditional relationships between different tiers and OEMs. The switch to software-defined vehicles is a top priority for the automotive ecosystem. It enables... » read more

Security Tradeoffs: A Difficult Balance


Experts At The Table: Semiconductor Engineering sat down to discuss hardware security challenges, including new threat models from AI-based attacks, with Nicole Fern, principal security analyst at Keysight; Serge Leef, AI-For-Silicon strategist at Microsoft; Scott Best, senior director for silicon security products at Rambus; Lee Harrison, director of Tessent Automotive IC Solutions at Sieme... » read more

Can Cheaper Lasers Handle Short Distances?


Optical technology is well established for long-haul communications, but the distances it serves are shrinking — especially in the data center. Vertical-cavity surface-emitting lasers (VCSELs) already drive short fiber links. But efforts are underway to further scale them down to provide more connections through waveguides than fiber can provide. “We have seen the transition from long... » read more

For Chip Developers, HW/SW Co-Design Key To Data Center Efficiency


Data centers and high-performance computing (HPC) are the primary enablers of today’s power-hungry AI-driven technology, but chip designers, EDA vendors, and the data centers themselves have a long list of options available to them to help curb AI's power consumption. Chip designers play a critical role in ensuring energy efficient processing from the bottom up, whether that is hardware-so... » read more

Multi-Modal AI In EDA Development Flows


RTL coding is a critical step in the development of semiconductors, but many would argue it is not the most difficult. Things become a lot more complex as you get closer to implementation, and as the system context becomes larger than can be comprehended by text alone. In both cases, layout, timing, power, and many other factors come into play, but none is as easily represented by text, and the... » read more

How AI Will Impact Chip Design And Designers


Experts at the Table: Semiconductor Engineering sat down to discuss the role and impact of AI in chip design with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at Synopsys; Sailesh Kumar, CEO of Baya Systems; Mehir Arora, head of engineering... » read more

When Standards Enable Chiplets


Semiconductor Engineering sat down and discussed the need for standards to enable an ecosystem for chiplets with Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice president for product marketing and management at Alphawave Semi; Hee-Soo Lee, HSD segment lead for Keysight; Mick Posner, senior product group director for Cadence’s Compute Solutions Group; and Rob Kr... » read more

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