category: Top Stories

category: Auto, Security & Edge AI

Can EDA Keep Growing?
By Ed Sperling - 26 Jun, 2014 - Comments: 0

Slower progress at the leading edge of process technology, coupled with rising costs and fewer design starts, are changing the economics of the EDA world. Not surprisingly, there is almost a direct correlation between the shrinking number of startups in the field and the number of customers working on the most advanced nodes. So what exactly does this mean for the EDA world? Big changes, for... » read more

Where Do We Stand With CDC?
By Ann Mutschler - 26 Jun, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss where the industry stands on clock domain crossing with Charlie Janac, CEO of Arteris; Shaker Sarwary, VP of Formal Verification Products at Atrenta; Pranav Ashar, CTO at Real Intent; and Namit Gupta, CAE, Verification Group at Synopsys. What follows are excerpts of that conversation. SE: While not a new aspect of design, clock domain crossing is... » read more

Semiconductor R&D Crisis Ahead?
By Ed Sperling - 26 Jun, 2014 - Comments: 0

Listen to engineering management at chipmakers these days and a consistent theme emerges: They’re all petrified about where to place their next technology bets. Do they move to 14/16nm finFETs with plans to shrink to 10nm, 7nm and maybe even 5nm? Do they invest in 2.5D and 3D stacked die? Or do they eke more from existing process nodes using new process technologies, more compact designs and ... » read more

Without Moore’s Law: EDA
By Brian Bailey - 26 Jun, 2014 - Comments: 3

Semiconductor Engineering is examining the assertion about the end of Moore’s Law in a number of different ways. The special report, “Will 7nm and 5nm really happen?” looked at the technical aspects related to continuing into finer geometries. “Moore’s Law Tail No Longer Wagging the Dog” asked the question about the economics of people being able to afford to go to the latest node. ... » read more

Tougher Memory Choices
By Brian Bailey - 23 Jun, 2014 - Comments: 1

In part 1 of this roundtable, the participants talked about the investments being made in memory technologies, the role that memories play in system security and the tools support for optimizing memory architecture. Taking part in the conversation are Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technolog... » read more

Five Disruptive Test Technologies
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

For years, test has been a critical part of the IC manufacturing flow. Chipmakers, OSATs and the test houses buy the latest testers and design-for-test (DFT) software tools in the market and for good reason. A plethora of unwanted field returns is not acceptable in today’s market. The next wave of complex chips may require more test coverage and test times. That could translate into higher... » read more

Mobile Packaging Market Heats Up
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to cram more chip functions in smaller IC packages, but there are some challenges in the arena. In fact, there are signs that the mainstream packaging technology for mobiles is running out of steam. For some time, mobile products have incorporated a technology called package-on-package (PoP), which u... » read more

DFM And Multipatterning
By Ed Sperling - 19 Jun, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss DFM at advanced nodes with Kuang-Kuo Lin, director of foundry design enablement at Samsung Electronics; Jongwook Kye, lithography modeling and architecture fellow at GlobalFoundries; David Abercrombie, advanced physical verification methodology program manager at Mentor Graphics; Ya-Chieh Lai, engineering director for DFM/CLS silicon signoff and ver... » read more

Will 7nm And 5nm Really Happen?
By Mark LaPedus - 19 Jun, 2014 - Comments: 11

As leading-edge chipmakers continue to ramp up their 28nm and 20nm devices, vendors are also updating their future technology roadmaps. In fact, IC makers are talking about their new shipment schedules for 10nm. And GlobalFoundries, Intel, Samsung and TSMC are narrowing down the options for 7nm, 5nm and beyond. There is a high probability that IC makers can scale to 10nm, but vendors face a ... » read more

Multi-beam Sees The Light
By Mark LaPedus - 19 Jun, 2014 - Comments: 2

The multiple-beam electron-beam market is going in two separate directions at once. Multi-beam for photomask writing is set to take off. The other market--multi-beam for direct-write lithography applications—is still in the early stages and remains in flux. In the multi-beam direct-write segment, for example, multiple sources indicate that KLA-Tencor is exiting this market to focus on its ... » read more

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