category: Top Stories

category: Auto, Security & Edge AI

Experts At The Table: Process Technology Challenges
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

450mm Silicon Wafer Issues Emerge
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus The most critical component in semiconductor manufacturing is arguably the silicon wafer, but the substrate is often taken for granted in the supply chain. After all, silicon wafer makers have nearly perfected their craft over the years and produce what many consider mere commodities. And on the business front, silicon wafer makers often find themselves with excess capacity... » read more

It’s A Materials World
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus At a recent event, Intel’s fab materials guru described a nightmarish occurrence that nearly brought the chip giant to its knees. Tim Hendry, director of fab materials and vice president of the Technology and Manufacturing Group at Intel, said the company obtained a critical material from an undisclosed supplier. “This large sub-supplier, a very large chemical company, m... » read more

ATE Market Changes With The Times
By Jeff Chappell - 15 Aug, 2013 - Comments: 0

By Jeff Chappell A declining PC market in recent years coupled with the continuing growth of mobile phones and tablets has meant changes throughout the semiconductor supply chain, and automated test equipment is no exception. For example, a decade ago memory test—namely DRAM—was a large market compared with that of nascent system-on-a-chip (SoC) testing. In fact, at the time some test e... » read more

China Foundries Seek Niches
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus For decades, China has launched several initiatives to modernize its semiconductor industry with hopes of becoming the next IC powerhouse in Asia. In 2001, for example, China unveiled its so-called "Tenth Five-Year Plan," which called for the nation to build 25 new fabs from 2001 to 2005. At the time, the Chinese government hoped to start and fund a new crop of domestic fou... » read more

Can Mask Data Prep Tools Manage Data Glut?
By Ann Mutschler - 15 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler The trend to reduce critical dimension sizes has in turn increased design file sizes, especially with the addition of optical proximity correction (OPC) steps. This extra data translates to a bigger burden to be processed downstream in the flow on the way to the mask writer. At 28nm, design post-OPC data files sizes reach hundreds of gigabytes. With 20nm and below ... » read more

Experts At The Table: 450mm Fab And Facilities Challenges
By Mark LaPedus - 09 Aug, 2013 - Comments: 0

Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab Solutions Business ... » read more

Experts At The Table: Automotive Electronics
By Ann Mutschler - 09 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss the opportunities in automotive electronics with Alexandre Palus, principal SoC architect at Altera; Aveek Sarkar, VP of product engineering & support at Apache; Mladen Nizic, engineering director, mixed signal solution at Cadence; and Stephen Pateras, product marketing director, silicon test solutions at Mentor Graphics. W... » read more

Mixing Custom And Standard Parts
By Ed Sperling - 08 Aug, 2013 - Comments: 0

By Ed Sperling The amount of third-party and re-used IP content in an SoC is on the rise, but once a decision to buy vs. make has been made it doesn’t always stay that way. In fact, chipmakers are swinging the pendulum back and forth across a variety of chips, building IP themselves, standardizing on another vendor’s IP, then sometimes rolling it back the other way. The reasons are usua... » read more

IoT Brings Power Awareness Opportunities
By Ann Mutschler - 08 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler Limited only by imagination, the “Internet of Things” (IoT) is breathing new life into many segments of the semiconductor industry that are losing hopes for growth in the SoC market. In virtually any vertical market space, from automotive to consumer, from industrial to networking, one can imagine the potential for what IoT concepts could realize including higher ... » read more

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