category: Top Stories

category: Auto, Security & Edge AI

Accelerating Moore’s Law
By Ed Sperling - 21 Feb, 2013 - Comments: 0

By Ed Sperling Ever since the inception of Moore’s Law, process nodes have moved forward at a rate of once every 18 to 24 months. Companies have been talking about slowing down the rate of progression as things get harder, but at least for the next couple of process nodes something very strange will occur—Moore’s Law will accelerate. The root cause is growing competition for a shrinki... » read more

Good Times For Analog Designers
By Ann Mutschler - 14 Feb, 2013 - Comments: 1

By Ann Steffora Mutschler For a number of technological reasons, analog/mixed-signal design and low-power design are converging, and with that comes both challenges and opportunities. As far as challenges go, process variations at 14nm, 20nm and even 28nm have increased significantly to include DFM impacts such as layout-delay effects. On the digital side, those process changes affect... » read more

Raising The Stakes For IP
By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling As the amount of IP in an SoC increases, so do the number of players who want to strengthen their position in this market. The big acquisitions that began several years ago over time have proved to be just opening salvos—something that was impossible to predict when this shift began. Synopsys’ purchase of Virage Logic and Cadence’s purchase of Denali, both of which occu... » read more

Too Hot To Handle
By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler It used to be that a device could be designed to a thermal design power. The worst case power scenario would be imagined, and the device would be designed with that in mind. But those good old days are gone. Especially for consumer devices, how a device is going to behave with respect to time, or how people are going to use it, must be understood as completely a... » read more

Managing Electrical Communications Better
By Ann Mutschler - 14 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Managing the electrical components of signal paths between IC, package, board and system is no small task, and it’s only growing in complexity. Understanding how to correctly optimize the communications within a system is critical given that the I/O power is becoming a significant portion of the overall chip power as the number of bits and the speed at which t... » read more

New Issues In Signoff
By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling Signoff has always been a challenge at every stage of an SoC design flow. No matter how good a design looks, or how well a prototype works, there are still problems that can crop up at any stage of the design flow all the way into manufacturing that can leave engineering teams shaking their heads. Even at mainstream process nodes, respins are common. At advanced nodes—part... » read more

Sprint To The Finish Line
By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss future challenges, pain points, and how the supply chain is being reconfigured with Chi-Ping Hsu, senior vice president for R&D in the Silicon Realization Group at Cadence. What follows are excerpts of that conversation. LPHP: Has the move to 20nm processes with 14nm finFETs progressed as smoothly as everyone hop... » read more

SoC Architects Face Big Challenges
By Ed Sperling - 31 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler While the geometries of advanced node processes such as 28nm and below may not greatly impact SoC architectures, the complexity enabled by the leading edge brings intense challenges all the same. With the ability to put more transistors onto a chip come new possibilities such as the increasing use of multi-core architectures and lots of integrated hardware en... » read more

Inside The System-Level Supply Chain
By Ed Sperling - 31 Jan, 2013 - Comments: 0

System-Level Design sat down to discuss supply chain issues with Bill Chown product marketing director for the system-level engineering division at Mentor Graphics and a longtime participant in a number of standards efforts across the semiconductor design industry. What follows are excerpts of that conversation. SLD: What’s happening with system engineering as chip design/manufacturing mo... » read more

Mixing It Up
By Ed Sperling - 31 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler To enable the next level of productivity in the verification space, certain tools need to be combined and integrated in a very meaningful way. The concept is far from new. This happened on the RTL to GDS front between synthesis and place and route. The tools work very closely and there is bi-directional collaboration. It also happened in the functional verification... » read more

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