Metals for advanced interconnects; future of plasma etching; IR drop prediction; power electronics packaging; NVM bitflips; probabilistic circuits; quantum photonics circuits.
New technical papers recently added to Semiconductor Engineering’s library.
| Technical Paper | Research Organizations |
|---|---|
| Selecting Alternative Metals for Advanced Interconnects | imec and KU Leuven |
| Future of plasma etching for microelectronics: Challenges and opportunities | University of Maryland, IBM, Arkema, UCLA, Lam Research, Intel Corporation, Samsung, Air Liquide, Sony et al |
| IR drop Prediction Based on Machine Learning and Pattern Reduction | National Tsing Hua University, National Taiwan University of Science and Technology, and MediaTek |
| Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs | University of Cambridge, University of Warwick, Chongqing University, and SpaceX |
| NVM-Flip : Non-Volatile-Memory BitFlips on the System Level | Ruhr-University Bochum, University of Duisburg-Essen, and Robert Bosch |
| On Hardware-efficient Inference in Probabilistic Circuits | Aalto University and UCLouvain |
| Programmable Nonlinear Quantum Photonic Circuits | Niels Bohr Institute, University of Copenhagen, University of Bristol, and Ruhr-Universitat Bochum |
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