Chip Industry’s Technical Paper Roundup: Nov. 15
Costs for chiplet architecture; nanosheets; TFETs; red-emitting microLEDs; SAQP; optical crossbar architecture; energy estimates in accelerators, supercomputers; simulating energy and security interactions in fabs; multi-Independent gate-controlled finFET; ferroelectric-based in-memory computing.
New technical papers added to Semiconductor Engineering’s library this week.
| Technical Paper |
Research Organizations |
|
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| Trends in Energy Estimates for Computing in AI/Machine Learning Accelerators, Supercomputers, and Compute-Intensive Applications |
SLAC/Stanford University and MIT |
| Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies |
University of California, Santa Barbara |
| Simulating Energy and Security Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Model |
Idaho National Laboratory, University of Texas at Austin, University of Texas at San Antonio and George Mason University |
| Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts |
TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology |
| Effect of high-pressure D2 and H2 annealing on LFN properties in FD-SOI pTFET |
Chungnam National University and Korea Polytechnic College |
| N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs |
University of Michigan |
| Characteristics of a Novel FinFET with Multi-Enhanced Operation Gates (MEOG FinFET) |
Changzhou University |
| Scalable Coherent Optical Crossbar Architecture using PCM for AI Acceleration |
University of Washington |
| Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning |
IBM TJ Watson Research Center and Rensselaer Polytechnic Institute |
| Achieving software-equivalent accuracy for hyperdimensional computing with ferroelectric-based in-memory computing |
University of Notre Dame, Fraunhofer Institute for Photonic Microsystems, University of California Irvine, and Technische Universität Dresden |
Linda Christensen
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Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering.
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