10nm Race Heats Up


The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

New Architectures, Approaches To Speed Up Chips


The need for speed is back. An explosion in the amount of data that needs to be collected and processed is driving a new wave of change in hardware, software and overall system design. After years of emphasizing power reduction, performance has re-emerged as a top concern in a variety of applications such as smarter cars, wearable devices and cloud data centers. But how to get there has cha... » read more

Confronting Design Challenges With Smaller Thermal Envelopes


For design engineers, physics giveth but physics can also taketh away. Consider leading-edge smartphones. Outside the improved performance that each generation gives consumers, the handsets themselves get thinner, sleeker, lighter. The reduction in the Z height is effectively a given with each new generation. In 2010, the HTC Nexus One was 11.5mm thick; this year, the Mate 8 is 7.9mm. Rem... » read more

Blog Review: Aug. 10


Is the end near for FinFETs? Applied's Mike Chudzik digs into the impact of rising parasitic resistance and parasitic capacitance and the challenges of scaling to 5nm. Cadence's Paul McLellan checks out the method UC Berkeley is using to build RISC-V processors. Mentor's Colin Walls warns that in C even the simplest things, like the declaration of variables, have pitfalls for the unwary. ... » read more

Is Security A Priority?


Ask any two executives in the semiconductor industry about security threats and there is a good chance you will get two totally different answers. The disturbing part is they both may be right. In markets where there is no physical danger to people, security always has been viewed a risk versus profit equation. At conferences over the past year, numerous executives have touted the Transport... » read more

The Week in Review: IoT


Deals Rambus finalized its acquisition of the memory interconnect business at Inphi. The closing price was $90 million in cash. The former Inphi business became part of the Memory and Interfaces Division at Rambus. CyberX raised $9 million of private funding in a financing round led by Flint Capital. Glilot Capital Partners, Swarth Group, and GlenRock, all existing investors, were joined by... » read more

Behind The ARM-SoftBank Deal


Weeks after SoftBank announced plans to buy ARM for $32 billion, the deal continues to reverberate across the global semiconductor industry. Any acquisition of this magnitude leaves customers, suppliers and partners a little skittish. And for good reason—ARM is the No. 1 supplier of commercial processor IP. Much of the fabless semiconductor market, as well as some IDMs, cross paths with AR... » read more

Blog Review: Aug. 3


Mentor's Andrew Macleod presents three hours of highlights from this year's IESF automotive conference in Detroit with topics from making cars more affordable to reaching an efficiency of 54.5 MPG. Cadence's Paul McLellan checks out the state of the smartphone landscape now that consolidation in the market seems to be complete at the Linley Mobile Conference. Synopsys' Eric Huang consider... » read more

What’s Holding Back Analog?


The uneasy relationship between digital and analog, coupled with tools that are either ineffective or outright ignored by the analog community, may be limiting the growth potential and technological advances in that market. That certainly doesn’t mean analog isn’t growing. In fact, analog is an increasingly critical component of ICs and the electronic devices they inhabit. The global ele... » read more

The Week In Review: Design


IP Rambus debuted 3200 Mbps DDR4 PHY, targeted at the data center and networking markets, on the GlobalFoundries FX-14 ASIC platform using the company's 14nm Power Plus (LPP) process. The PHY is DFI 4.0 compatible, and supports 16 – 72-bit interfaces, along with single and multi-rank configurations. Synopsys introduced VIP and UVM source code test suite for Ethernet 200G, supporting 4x5... » read more

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