Chip Industry Technical Paper Roundup: June 18


New technical papers added to Semiconductor Engineering’s library this week. [table id=234 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

KAN: Kolmogorov Arnold Networks: An Alternative To MLPs (MIT, CalTech, et al.)


A new technical paper titled "KAN: Kolmogorov-Arnold Networks" was published by researchers at MIT, CalTech, Northeastern University and The NSF Institute for Artificial Intelligence and Fundamental Interactions. Abstract: "Inspired by the Kolmogorov-Arnold representation theorem, we propose Kolmogorov-Arnold Networks (KANs) as promising alternatives to Multi-Layer Perceptrons (MLPs). While... » read more

Chip Industry Technical Paper Roundup: June 10


New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Research Bits: June 4


Ultra-pure silicon Researchers from the University of Manchester and University of Melbourne developed a technique to engineer ultra-pure silicon that could be used in the construction of high-performance qubit devices that extend quantum coherence times. The highly purified silicon chips house and protect the qubits so they can sustain quantum coherence much longer, enabling complex calcul... » read more

Chip Industry Week In Review


JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

GaN Devices: Properties and Performance At Extremely High Temperatures


A new technical paper titled "High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C" was published by researchers at MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology. Abstract "This Letter reports the stability of regrown and alloyed Ohmic contacts to A... » read more

Chip Industry Week In Review


Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

Fundamental Issues In Computer Vision Still Unresolved


Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS to medical diagnosis and robotics, it is critical that its weak points be mitigated, such as the ability to identify corner cases or if algorithms are trained on shallow datasets. While well-known bloopers are often the result of human decisions, there are also fundamental technical issues that ... » read more

Research Bits: April 30


Sound waves in optical neural networks Researchers from the Max Planck Institute for the Science of Light and Massachusetts Institute of Technology found a way to build reconfigurable recurrent operators based on sound waves for photonic machine learning. They used light to create temporary acoustic waves in an optical fiber, which manipulate subsequent computational steps of an optical rec... » read more

← Older posts