tag: NAND

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jul, 2014 - Comments: 0

Looking to address a new wave of chip architectures in the marketplace, Applied Materials has rolled out its next-generation, medium-current ion implanter. The system, dubbed the VIISta 900 3D, is geared for the production of finFETs and 3D NAND designs at the sub-2xnm nodes. Typically, medium-current implanters have a maximum energy range of about 900keV (triple-charge), with dose ranges fr... » read more

Plugging Information Leaks
By Kenji Tsuda - 21 Apr, 2014 - Comments: 0

A former SanDisk employee was arrested on suspicion of leaking proprietary information about Toshiba’s semiconductor memory to SK Hynix. What makes this particularly interesting is SanDisk is one of Toshiba’s current business partners. The two companies have a joint venture in NAND flash, which competes with South Korea’s SK Hynix. Nihon Keizai Shimbun broke the story last month. Sugi... » read more

Searching For Rare Earths
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

The semiconductor industry is pre-occupied with several and expensive technologies at once. One the device side, the industry is looking at new chip architectures, such as 3D NAND, finFETs and stacked die. On the manufacturing front, there is 450mm technology, next-generation lithography (NGL) and new materials. And that’s just the tip of the iceberg. Another technology that deserve... » read more

NAND ATE Market Gets Testy
By Mark LaPedus - 06 Feb, 2014 - Comments: 0

The NAND flash memory market is undergoing big changes. As planar NAND moves further down the 1xnm node regime, suppliers are ramping up devices with new cell structures, interfaces and other features. And on top of that, 3D NAND is beginning to appear in the market. The next-generation NAND devices will enable new applications in the mobile and enterprise markets, but the chips themselves p... » read more

The Bumpy Road To 3D NAND
By Mark LaPedus - 23 Jan, 2014 - Comments: 1

The NAND flash memory market is dynamic, but it’s also sometimes predictable. Suppliers tend to roll out identical NAND flash chips and then scale them to smaller geometries. And NAND chip prices rise and fall, depending on the supply/demand equation at a given point. Going forward, though, the NAND market is expected to become less predictable, if not chaotic, amid a new and major technol... » read more

The Road Ahead for 2014: Semiconductors
By Brian Bailey - 23 Jan, 2014 - Comments: 1

Last week, Semiconductor Engineering examined the 2014 predictions from several thought leaders in the industry and published those predictions that related to general market trends. Many of those predictions require some advances in semiconductor technologies and fabrications capabilities. It is those predictions that will be examined in this part, followed next week by the predictions related... » read more

Applied To Buy TEL
By Mark LaPedus - 24 Sep, 2013 - Comments: 0

In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%.  The combined entities will have a new name, dual headquarter... » read more

What’s After 3D NAND?
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

ATE Market Changes With The Times
By Jeff Chappell - 15 Aug, 2013 - Comments: 0

By Jeff Chappell A declining PC market in recent years coupled with the continuing growth of mobile phones and tablets has meant changes throughout the semiconductor supply chain, and automated test equipment is no exception. For example, a decade ago memory test—namely DRAM—was a large market compared with that of nascent system-on-a-chip (SoC) testing. In fact, at the time some test e... » read more

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