tag: OSAT

Panel-Level Packaging’s Second Wave Meets Engineering Reality
By Gregory Haley - 16 Apr, 2026 - Comments: 0

Key Takeaways Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down. Glass improves the warpage and dimensional stability problems of organic substrates but introduces a different class of failure modes that require materials solutions, not process adjustments. The central challenges of panel-level processing are m... » read more

Enabling The Future: Heterogeneous Integration From Connected Devices To Data Centers
By WonChul Do - 23 Oct, 2025 - Comments: 0

The digital landscape is evolving at an unprecedented pace. From smartphones and wearables to autonomous vehicles and hyperscale data centers, the demand for faster, smarter, and more efficient electronics is reshaping the semiconductor industry. At the core of this transformation is heterogeneous integration—the convergence of multiple technologies, functions, and components into unified sys... » read more

Enhancing Clip Attach Vision Accuracy In Semiconductor Manufacturing
By Mahenthren Palaniappan - 18 Sep, 2025 - Comments: 0

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, OSAT companies are entrusted with the critical task of assembly, testing, and packaging of devices. Maintaining quality in OSAT operations is of paramount importance, as it directly impacts the pe... » read more

Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
By Vineet Pancholi - 21 Nov, 2024 - Comments: 1

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s website does a good job of detailing the anecdotal path of multi-die systems by way of chiplet building blocks integrated within a single package [2]. The presentation includes references to a ha... » read more

Package Assembly Design Kits (PADK) Benefits For Packaging Design Engineers
By Amkor - 21 Nov, 2024 - Comments: 0

A new IEEE technical paper titled "Package Assembly Design Kits (PADK's)- The Future of Advanced Wafer-Level Manufacturing" was written by researchers from Amkor. Find the technical paper here. September 2024. "Although package design and IC design are two different worlds, they share several key similarities that have contributed to the successful use of Package Assembly Design Kits (PAD... » read more

Package Assembly Design Kits: The Future Of Advanced Package Design
By Ruben Fuentes - 23 May, 2024 - Comments: 0

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized heterogeneous design experience that optimizes the device's intended package performance with complete connectivity verification, DRC, and assembly validation. Another primary reason is the ongoing f... » read more

Goals of Going Green
By Anne Meixner - 25 Jul, 2023 - Comments: 0

The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. Some manufacturers have been addressing sustainability challenges for more than a decade, but they are becoming more aggressive in their efforts, while others are joining them. A review of sustainability reports across the semiconductor indust... » read more

Smarter Ways To Manufacture Chips
By Anne Meixner - 20 Apr, 2023 - Comments: 0

OSAT and wafer fabs are beginning to invest in Industry 4.0 solutions in order to improve efficiency and reduce operating costs, but it's a complicated process that involves setting up frameworks to evaluate different options and goals. Semiconductor manufacturing facilities have relied on dedicated automation teams for decades. These teams track and schedule chip production, respond to equi... » read more

Using Machine Learning To Increase Yield And Lower Packaging Costs
By Melvin Lee - 11 Apr, 2023 - Comments: 0

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test (OSAT) houses have to spend more money, more time and more resources on assembly and testing. As such, one of the more important challenges facing OSATs today is managing die that pass testing at the ... » read more

An OSAT Perspective On Semiconductor Market Trends
By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

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