Digital Twins: The Cloud’s The Limit


Key Takeaways Digital twins are gaining traction as a way of testing different options at every step of the design-through-manufacturing flow. AI can be used to glue together disparate data types in multi-physics simulations. The promise of digital twins is huge, but multiple challenges need to be solved before it can live up to its potential. Digital twin technology is draw... » read more

Chip Industry Week In Review


Think tank IAPS' report on AI integrity attacks contends that advanced AI systems must be protected from hidden tampering, backdoors, or unauthorized changes that could alter their behavior or outputs, especially when AI adoption is scaling rapidly, with over 60% of the federal workforce now using AI every day. Geopolitics The U.S. government has drafted new export rules that may give W... » read more

25G Ethernet: Scaling Data Movement For ADAS, Industry 4.0, And 5G Systems


The automotive and industrial markets are undergoing rapid transformation, driven by Advanced Driver Assistance Systems (ADAS) adoption, Industry 4.0 automation, and the rollout of 5G infrastructure. These trends are driving an unprecedented demand for edge AI capabilities and connectivity, with the global Edge AI IC market projected to grow at a 34.7% CAGR and reach $340B by 2034 [1]. Traditio... » read more

Auto Security Accelerates With Standardization And Certified Silicon


Key Takeaways The automotive sector is actively developing and delivering secure parts and features ranging from secure boot to encrypted data and in-network protections. The cost of a breach can involve everything from ransomware to liability and/or damage to a brand. New standards are being introduced to ensure security, and technology developers are integrating cybersecurity requi... » read more

Limiting AI/ML Tools To Ensure Physical AI Safety, Security


Key Takeaways: AI-based tools can help monitor physical AI systems and LLMs, but human oversight is still needed to avoid false positives, bias, and other anomalies. For autonomous vehicles and robots, edge case scenarios and understanding human values are weak points, especially as moral and social values change over time. AI tools are growing and becoming increasingly helpful for c... » read more

New Automotive Architectures Are Shaking Up Processor And Memory Choices


Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence makes it easier to identify where the most advanced processors and memories are required, and where older and less expensive technologies can be deployed. Technologies that were largely ... » read more

Blog Review: Mar. 4


Cadence's Subash Peddu digs into the challenge of balancing performance, power efficiency, SoC layout optimization, and futureproofing when defining SoCs and memory subsystems for tomorrow’s AI accelerators. Siemens' Nicolae Tusinschi suggests that formal verification isn't just about finding bugs, and the ability to achieve mathematical certainty can fundamentally change how hardware desi... » read more

Making Hybrid Bonding Better


Key Takeaways Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps preserve the Cu/dielectric during aggressive processes. The future of semiconductor manufacturing is no longer dependent just on shrinking features. Instead, chipm... » read more

Chip Industry Week In Review


Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

How IP Subsystems For Chiplets Will Unlock Your Next Wave Of Innovation


After many years of hope, promises, and commercial challenges, a robust environment that supports multi-die design is now taking shape. These events represent a sea of change for semiconductor design and manufacturing when compared to the traditional single-die monolithic design approach. Moore’s Law drove these original and substantial monolithic design accomplishments. But the massive requi... » read more

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