3 Challenges Of Delivering Configurable Semiconductor IP


Over time, commercial IP products have morphed from single function blocks to 100% configurable IPs where no two instances are the same. In this article I point out the challenges of creating configurable IP, and the best-known practices to address them. IP Configurability Spectrum Throughout the history of chip design, there has been a spectrum of configurability that has been built into i... » read more

Semiconductor R&D Crisis Ahead?


Listen to engineering management at chipmakers these days and a consistent theme emerges: They’re all petrified about where to place their next technology bets. Do they move to 14/16nm finFETs with plans to shrink to 10nm, 7nm and maybe even 5nm? Do they invest in 2.5D and 3D stacked die? Or do they eke more from existing process nodes using new process technologies, more compact designs and ... » read more

Without Moore’s Law: EDA


Semiconductor Engineering is examining the assertion about the end of Moore’s Law in a number of different ways. The special report, “Will 7nm and 5nm really happen?” looked at the technical aspects related to continuing into finer geometries. “Moore’s Law Tail No Longer Wagging the Dog” asked the question about the economics of people being able to afford to go to the latest node. ... » read more

Using VDKs For Automotive Systems Development


The software content of automotive systems found in powertrain, chassis, safety, body and advanced driver assistance systems (ADAS) application is increasing. At the same time, the pressure to accelerate development time lines, improve reliability and maintain/reduce costs is also increasing. Automotive OEM, Tier 1 and semiconductor companies involved in embedded software development, integrati... » read more

Blog Review: June 25


Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

Tougher Memory Choices


In part 1 of this roundtable, the participants talked about the investments being made in memory technologies, the role that memories play in system security and the tools support for optimizing memory architecture. Taking part in the conversation are Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technolog... » read more

The Week In Review: Design


M&A Cadence completed its acquisition of Jasper Design Automation, using cash and revolving credit to finance the deal. It will explain the impact on 2014 financial results in fiscal 2015. Jasper’s team, led by CEO Kathryn Kranen, will now report to Cadence senior VP Charlie Huang in Cadence’s System & Verification Group. The deal was first announced in April. Tools Coverity un... » read more

Five Disruptive Test Technologies


For years, test has been a critical part of the IC manufacturing flow. Chipmakers, OSATs and the test houses buy the latest testers and design-for-test (DFT) software tools in the market and for good reason. A plethora of unwanted field returns is not acceptable in today’s market. The next wave of complex chips may require more test coverage and test times. That could translate into higher... » read more

Ethernet: The Highway For Automotive Electronics?


What happens when technology from the fast paced communication industry makes a move into the traditional automotive industry? Semiconductor marketers and even the automotive industry are talking about revolutionary changes inside and outside the vehicle. What kinds of changes? Ethernet and sensors. There’s a lot of excitement and enthusiasm over the prospect of cars with Ethernet networki... » read more

Has The IC Industry Hit A ‘Red Brick Wall’?


In the mid-1980s, the semiconductor industry was in a crisis. Chipmakers were looking for ways to break the magical one-micron barrier. Many thought X-ray lithography would be required to break the barrier, but as it turned out, traditional optical technology did the trick. And the industry marched on. Then, in 2000 or so, the IC industry was nearing the so-called “red brick wall,” which... » read more

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