中文 English

LDFO SiP For Wearables & IoT With Heterogeneous Integration


Authors A. Martins*, M. Pinheiro*, A. F. Ferreira*, R. Almeida*, F. Matos*, J. Oliveira*, Eoin O´Toole*, H. M. Santos†, M. C. Monteiro‡, H. Gamboa‡, R. P. Silva* ‡Fraunhofer Portugal AICOS, Porto, Portugal †INESC TEC *AMKOR Technology Portugal, S.A. ABSTRACT The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the require... » read more

Challenges Grow For 5G Packages And Modules


The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more