tag: Applied Materials

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Aug, 2018 - Comments: 0

Trade wars It’s difficult to keep up with the U.S.-China trade war. In the latest event, the U.S. Trade Representative (USTR) recently released a 25% tariff on $16 billion in imports from China. This includes 29 tariff lines that represent the heart of the semiconductor industry, according to SEMI. “SEMI, along with hundreds of companies, including Lam Research and KLA-Tencor, submitted wr... » read more

Next-Gen Memory Ramping Up
By Mark LaPedus - 16 Aug, 2018 - Comments: 6

The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

Adapt Or Fall Behind: Surviving And Thriving In The Competitive Jungle Of Plant Operations Scheduling And IIoT
By Applied Materials - 16 Aug, 2018 - Comments: 0

Biopharmaceutical manufacturing has required significant technological developments in the area of cell culture, chromatography, and purification. It is no small miracle that every day across the world, millions of liters of cell culture capacity generates life-saving medicines for the patients who need it. The bio-manufacturing process is unique in its need for— Tight regulation of an i... » read more

The Materials Side Of AI
By Jonathan Bakke - 16 Aug, 2018 - Comments: 0

As we enter the foundry 7nm and below technology nodes, tungsten fill for contacts has reached the physical limits of scaling and copper used in the lowest level interconnects is facing challenges on multiple fronts. Solving these issues will require a new conducting material, namely cobalt. This transition can enable continued device scaling and less power consumption per computation. Follo... » read more

Blog Review: Aug. 8
By Jesse Allen - 08 Aug, 2018 - Comments: 0

Cadence's Meera Collier provides a primer on the basics of quantum computing, including how quantum gates work using superpositions and how it could impact chip design. Mentor's Dennis Brophy shares a list of resources to help you get up to speed on the recently-approved Portable Test and Stimulus standard, which enables test scenarios to be run across different execution platforms. Synop... » read more

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

The Role Of Cobalt In Enabling AI
By Jonathan Bakke - 19 Jul, 2018 - Comments: 0

We are on the cusp of the biggest computing wave yet — the AI era driven by Big Data. Enabling this era will require significant enhancements in processor performance and in the capacity and latency of memory. These requirements are coming at a time when the industry is being increasingly challenged by a slowdown in classic Moore’s Law scaling. What’s needed to continue driving the indust... » read more

Blog Review: July 4
By Jesse Allen - 04 Jul, 2018 - Comments: 0

Applied Materials' Sundeep Bajikar argues that to get the full benefits of AI, new computing architectures are needed – and that will require new breakthroughs in materials engineering to get beyond classic 2D scaling. Cadence's Tom Wong considers to what extent chip dis-integration is happening and how the industry can cope with the escalating costs of new process nodes and higher-speed i... » read more

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