tag: Applied Materials

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jan, 2017 - Comments: 0

Chipmakers Faced with a huge write-down at its nuclear operations, Toshiba is looking to spin off its semiconductor division, which makes NAND. As expected, Toshiba seeks investors in the new company, according to Nikkei. Western Digital (WD) is one potential investor. Foxconn is another possible investor, according to CNBC. Peregrine Semiconductor has rolled out its latest RF SOI process.... » read more

New Embedded Memories Ahead
By Mark LaPedus - 25 Jan, 2017 - Comments: 0

The embedded memory market is beginning to heat up, fueled by a new wave of microcontrollers (MCUs) and related chips that will likely require new and more capable nonvolatile memory types. The industry is moving on several different fronts in the embedded memory landscape. On one front, traditional solutions are advancing. On another front, several vendors are positioning the next-generatio... » read more

Blog Review: Jan. 25
By Jesse Allen - 25 Jan, 2017 - Comments: 0

Synopsys' Anand Thiruvengadam looks at why there's an increased need for mixed-signal verification. Mentor's Craig Armenti argues for incorporating design for reliability into PCB projects. Cadence's Paul McLellan reports from the latest in ESDA's Emerging Companies series about the roots and future of RISC-V. NI's James Kimery shares updates from the 3GPP Workshop on 5G in Vienna. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

Transferring Skills Getting Harder
By Ed Sperling - 19 Jan, 2017 - Comments: 0

Rising complexity in developing chips at advanced nodes, and an almost perpetual barrage of new engineering challenges at each new node, are making it more difficult for everyone involved to maintain consistent skill levels across a growing number of interrelated technologies. The result is that engineers are being forced to specialize, but when they work with other engineers with different ... » read more

What’s Up MEMS?
By Mike Rosa - 19 Jan, 2017 - Comments: 0

Strong segment growth. A whole slew of new devices on the horizon. A healthy pipeline of enabling critical problems to be solved. Has somebody been peeking at my Christmas list? Possibly yes, and thankfully so, because 2016 has been that kind of year in MEMS. Taking a look at the numbers from Yole Developpement, they expect 2016 MEMS device segment revenue to be around $13B, with an estimate... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

Blog Review: Jan. 18
By Jesse Allen - 18 Jan, 2017 - Comments: 0

Mentor's Michael White warns that while skipping a node can be appealing, be prepared for the increase in computation requirements. Synopsys' Hezi Saar checks out the benefits of moving to the MIPI I3C standardized sensor interface. Cadence's Paul McLellan highlights a talk by Eric Grosse on approaches to security and the RISC-V architecture. Applied's Mike Chudzik explains the problem... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Jan, 2017 - Comments: 0

Chipmakers and OEMs Samsung NEXT, formerly called the Samsung Global Innovation Center, has announced the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund. The idea is to fund early stage startups. What’s next in consumer electronics? At CES 2017, Samsung unveiled a wide range of new products, such as quantum dot TVs, smart appliances, gaming laptops and s... » read more

Smart Manufacturing Gains Momentum
By Ed Sperling - 05 Jan, 2017 - Comments: 0

Smart manufacturing is gaining traction as a way of addressing increased market fragmentation while still leveraging economies of scale. The goal is to add a level of flexibility into manufacturing processes that until recently was considered impossible. Although the approach makes sense in theory, real-world implementation is proving far from consistent. Sometimes referred to as Industr... » read more

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