Altering A Car’s Behavior With Updates


The electronic content inside a car is growing rapidly, which is having a big effect on the way in which different vehicles are designed and built. As a direct consequence of this, the biggest technical change is now beginning to happen – one that overturns the traditional relationship between the car manufacturer and the car owner. With many subsystems now controlled by microprocessors ru... » read more

5 Big Under-The-Hood Engineering Challenges In Building Autonomous Vehicles


Stories about autonomous vehicles are regular fare in the tech news cycle and usually include forecasts about the eventual ascendancy of self-driving cars. The Boston Consulting Group, for example, says that by 2035, 25% of all cars will have partial or full autonomy, with total global sales growing from near-zero levels in 2015 to $42 billion in 2025 and ~ $77 billion by 2035. In short few ye... » read more

IP Business Changing As Markets Shift


Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of [getentity id="22203" e_name="ClioSoft"]; and Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of product marketing for [getentity id="22032" e_name="Cadence"]'s IP Group; and John Koeter, vice president of marketing for [getentity id="22035" e_name="Synopsys"... » read more

Explosive Growth Ahead


Over the next five years, sales across the semiconductor supply chain will double from $2 trillion to $4 trillion, said Ajit Manocha, president and CEO of SEMI, during the opening presentation at Semicon West this month. These are gigantic numbers, and they reflect some massive shifts now underway across the semiconductor industry. Many chipmakers have been trying to figure out the next big ... » read more

Reducing Latency In ADAS SoC Design Enhances QoS For Digital Mirroring


The state-of-the-art of Advanced Driver Assistance Systems (ADAS) is quickly changing, and ADAS chip engineers are finding that on-chip quality-of-service (QoS) is becoming a system-level constraint on ADAS performance. Designers need innovative approaches to address these issues, which is why Dream Chip Technologies highlighted one such method in a recent presentation. Dream Chip Technologi... » read more

Using Formal To Verify Safety-Critical Hardware For ISO 26262


Automotive technology has come a long way since the days of the Ford Model T. Today's smart vehicles not only assist their drivers with tasks such as parking, lane management, and braking, but also function as a home away from home, with WiFi hotspots and sophisticated entertainment systems. These sophisticated features are made possible by increasingly complex electronic systems—systems that... » read more

Foundries Accelerate Auto Efforts


Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

The Basics Of Foundation IP For Automotive ICs


This white paper provides a broad overview of requirements that must be considered in order to design and manufacture integrated circuits (ICs) for the automotive sector. The paper looks specifically at the standards that apply to Foundation IP - logic libraries, embedded memories, and memory built-in self-test (BIST) - for different automotive IC functions and how reliability grades affect IP ... » read more

5G Test Equipment Race Begins


Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Advanced Packaging Picks Up Steam


The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of [getkc id="199" kc_name="SiP"] is that it allows more features to be squeezed into ever-smaller form factors, such as wearable gadgets and medical implants. So while the individual chips in this package may ... » read more

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