tag: automotive

Foundry Wars, Take Two
By Ed Sperling - 25 May, 2017 - Comments: 0

Samsung, GlobalFoundries, TSMC and Intel all have declared their intention to fill in nearly every node possible with multiple processes, different packaging options, and new materials. In fact, the only number that hasn't been taken so far is 9nm. It's not that one foundry's 10nm is the same as another's. Each company defines its nodes differently, and these days comparing nodes is almost m... » read more

Emulation Enabling Automotive Designs
By Frank Schirrmeister - 25 May, 2017 - Comments: 0

Last week at CDNLive in Munich, the key topic at hand was automotive. It was pretty much a theme everywhere, and even had its specific personal track. My personal favorites were Davide Santo’s (NXP’s Architect) keynote on autonomous driving—very inspiring—and Robert Bosch’s overview of how they used emulation in a hybrid setup with ARM Fast Models for IP verification for automotive de... » read more

Samsung Unveils Scaling, Packaging Roadmaps
By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

Embracing ISO 26262: Efficient Verification Of Safety-Critical Hardware
By OneSpin Solutions - 24 May, 2017 - Comments: 0

Automotive technology has come a long way since the days of the Ford Model T. Today's smart vehicles not only assist their drivers with tasks such as parking, lane management, and braking, but also function as a home away from home, with WiFi hotspots and sophisticated entertainment systems. All of these features have been made possible by increasingly complex electronic systems. Welcome though... » read more

Whatever Happened To HLS?
By Brian Bailey - 24 May, 2017 - Comments: 1

A few years ago, [getkc id="105" comment="high-level synthesis"] (HLS) was probably the most talked about emerging technology that was to be the heart of a new [getkc id="48" kc_name="Electronic System Level"] (ESL) flow. Today, we hear much less about the progress being made in this area. Semiconductor Engineering sat down to discuss this with Bryan Bowyer, director of engineering for high-lev... » read more

Blog Review: May 24
By Jesse Allen - 24 May, 2017 - Comments: 0

Mentor's Andrew Patterson questions who should have control over who sees the vast amounts of data generated by automobiles and how it is used. In a series of posts, Cadence's Meera Collier considers philosophical questions from the angle of computer science. Synopsys' Eric Huang has a lighthearted look at today's world of robots. Rambus' Aharon Etengoff points to Director of National ... » read more

Voice Recognition’s Role In Safer, More Secure Car Design
By Soshun Arai - 11 May, 2017 - Comments: 0

By Soshun Arai, ARM, and Mark Sykes, Recognition Technologies Look around the dashboard of a modern car and you will see dials, buttons and knobs everywhere. While each has its own purpose, they can confuse and distract people, especially when a driver should be paying attention to the road. Add to this new laws that promise harsher punishments for drivers using mobile devices, and you can s... » read more

Analog’s Unfair Disadvantage
By Brian Bailey - 11 May, 2017 - Comments: 0

We live in an analog world, and yet digital has become the technology of choice. Mixed-signal solutions that used to contain significant amounts of analog, with just a small amount of digital signal processing, have migrated into systems where the analog to digital conversion happens at the very first opportunity. There are several reasons for this, and some of them build upon themselves. [g... » read more

Wireless Test: Too Many Protocols
By Jeff Dorsch - 08 May, 2017 - Comments: 0

Testing wireless communications is getting far more difficult as more markets begin adding wireless communications and standards groups push to improve the speed, power and security of existing protocols. There is already a long list of protocols, and it's growing further as new communications technologies are added into the mix. With the addition of 5G, the new 802.11ax standard, and other ... » read more

Wirebond Technology Rolls On
By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

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