Routing Congestion Returns


By Ed Sperling Routing congestion has returned with a vengeance to SoC design, fueled by the advent of more third-party IP, more memory, a variety of new features, as well as the inability to scale wires at the same rate as transistors. This is certainly not a foreign concept for IC design. The markets for place and route tools were driven largely by the need to automate this kind of operat... » read more

3D Stacked Die Create Unique Test Issues


By Ann Steffora Mutschler While 3D die stacking promises a number of benefits including smaller footprint, faster speed, lower power and possibly lower cost, testing those devices isn’t going to be simple. There are varying degrees of challenges aligned with varying types of defects that occur throughout the process, from wafer fabrication to package assembly to system-level assembly. And... » read more

Rethinking Test


By Ann Steffora Mutschler The responsibility of semiconductor test has long sat solely with the test engineer as the chip designer focused on the functionality of the device. However, particularly in low-power designs, when the device is being tested, much higher power levels are applied than normal functional operation – sometimes causing the device to fail. This ‘false failure’ c... » read more

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