tag: Boise State University

Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Manufacturing Bits: Jan. 22

By Mark LaPedus - 22 Jan, 2019 - Comments: 1

Open-source CVD Boise State University has developed an inexpensive chemical vapor deposition (CVD) system to enable the growth of two-dimensional (2D) materials. Using open-source designs and off-the-shelf components, researchers have developed an automated CVD system for $30,000 in hardware costs, according to Boise State in the journal PLoS One. 2D materials could enable a new class ... » read more

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