Unintended Coupling Issues Grow


The number of indirect and often unexpected ways in which one design element may be affected by another is growing, making it more difficult to ensure a chip — or multiple chips in a package — will perform reliably. Long gone are the days when the only way that one part of a circuit could influence another was by an intended wire connecting them. As geometries get smaller, frequencies go... » read more

RF To mmWave Design For Systems


RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

CFD Playing Increasing Role In Design


With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Why Data Center Power Will Never Come Down


Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

Spreadsheets: Still Valuable, But More Limited


Spreadsheets have been an invaluable engineering tool for many aspects of semiconductor design and verification, but their inability to handle complexity is squeezing them out of an increasing number of applications. This is raising questions about whether they still have a role, and if so, how large that role will be. There are two sides to this issue. On one side are the users who see them... » read more

Design Challenges Increasing For Mixed-Die Packages


The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design


In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

A New Dimension Of Complexity For IC Design


Full 3D designs involving logic-on-logic are still in the tire-kicking stage, but gaps in the tooling already are showing up. This is especially evident with static timing analysis (STA), which is used to validate a design’s timing performance by checking all possible paths for timing violations. STA issues began popping up particularly with the introduction of hybrid bonding, a bumpless p... » read more

Growth Spurred By Negatives


The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

MIPI Standards Gaining Traction In New Markets


An explosion of low-cost, high-performance image sensors for a growing number of applications is propelling the MIPI interface into a variety of new markets, where standardized signal protocols and characteristics are becoming essential. For years, MIPI has been almost synonymous with mobile phones. But as higher-resolution image sensors increasingly are deployed in automotive, AI, IoT, and ... » read more

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