tag: Cadence

IP Biz Changes As Markets Fragment
By Ed Sperling - 22 Aug, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of [getentity id="22203" e_name="ClioSoft"]; Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of product marketing for [getentity id="22032" e_name="Cadence"]'s IP Group; and John Koeter, vice president of marketing for [getentity id="22035" e_name="Synopsys"]' S... » read more

Blog Review: Aug. 16
By Jesse Allen - 16 Aug, 2017 - Comments: 0

Cadence's Paul McLellan checks out how Imec sees the future of transistors and the challenges of 3D logic. Synopsys' Robert Vamosi gets a lesson on the electronic systems powering modern cars, and considers when it's ethical to hack one. Mentor's Colin Walls takes a look at how to pass data between RTOS tasks. Rambus' Aharon Etengoff looks at recent semi market predictions, from expand... » read more

How Reliable Are FinFETs?
By Ann Mutschler - 16 Aug, 2017 - Comments: 1

Stringent safety requirements in the automotive and industrial sectors are forcing chipmakers to re-examine a number of factors that can impact reliability over the lifespan of a device. Many of these concerns are not new. Electrical overstress (EOS), electrostatic discharge (ESD) and [getkc id="160" kc_name="electromigration"] (EM) are well understood, and have been addressed by EDA tools f... » read more

The Week In Review: Design
By Jesse Allen - 11 Aug, 2017 - Comments: 0

M&A Mentor acquired Valydate, provider of the VERA schematic integrity analysis tool. Founded in 2010, the Canadian company also offered signal and power integrity and static timing analysis services. Valydate's technology will be integrated with Mentor's Xpedition PCB design flow, though former Valydate CEO Michael Alam says it will continue to serve all EDA environments. Tools Aldec ... » read more

Using CNNs To Speed Up Systems
By Ann Mutschler - 10 Aug, 2017 - Comments: 0

Convolutional neural networks (CNNs) are becoming one of the key differentiators in system performance, reversing a decades-old trend that equated speed with processor clock frequencies, the number of transistors, and the instruction set architecture. Even with today's smartphones and PCs, it's difficult for users to differentiate between processors with 6, 8 or 16 cores. But as the amount o... » read more

I Say ‘High’ [Performance], You Say ‘Low’ [Power]
By Vinay Patwardhan - 10 Aug, 2017 - Comments: 0

“…You say ‘why’, and I say ‘I don’t know…’” Actually, I do know. Everybody loves a high-performance product. Even just hearing that a product is high-performance sets higher expectations than if the product is simply described as “fast” or “powerful.” When it comes to SoC design, “high-performance” refers to a set of designs that run at very high clock freque... » read more

Is Design Innovation Slowing?
By Brian Bailey - 10 Aug, 2017 - Comments: 0

Paul Teich, principal analyst for Tirias Research, gave a provocative talk at the recent DAC conference entitled, "Is Integration Leaving Less Room for Design Innovation?" The answer isn't as simple as the question might suggest. "Integration used to be a driver for increasing the functionality of silicon," Teich said. "Increasingly, it will be used to incorporate more features of an entire ... » read more

IP Challenges Ahead
By Brian Bailey - 10 Aug, 2017 - Comments: 0

The revenue from semiconductor [getkc id="43" kc_name="IP"] has risen steadily to become the largest segment of the EDA industry. Industry forecasts expect it to keep growing at a CAGR of more than 10% for the next decade. Part one of this article examined the possibility those forecasts are wrong and that large semiconductor companies are likely to start bringing IP development back in hous... » read more

Modeling Of The Electrical Performance Of The Power And Ground Supply For A PC Microprocessor On A Card
By Cadence - 09 Aug, 2017 - Comments: 0

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances ... » read more

Blog Review: Aug. 9
By Jesse Allen - 09 Aug, 2017 - Comments: 0

Cadence's Paul McLellan digs into a recently discovered vulnerability in the Broadcom Wi-Fi chip used in many smartphones and why it should be a wakeup call for SoC designers. Mentor's Craig Armenti considers whether work-in-process design data management is an asset or a liability. Synopsys' Thomas M. Tuerke notes that in code, as in medicine, proper hygiene is should be treated as a con... » read more

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