tag: Cadence

Asynchronous’ Impact On Tools
By Ann Mutschler - 25 Jun, 2015 - Comments: 0

In the right situation, using asynchronous logic makes a lot of sense—especially for security and IoT. But moving into the asynchronous design involves making tradeoffs, figuring out how the technical requirements of an application will impact the design, and understanding the limits of EDA tools in this area. “It's going to be halfway between digital and analog support,” said Bernard ... » read more

IP Integration Challenges Increase
By Ed Sperling - 24 Jun, 2015 - Comments: 0

Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

Interoperable Application-Specific Solutions For Formal Verification
By Cadence - 24 Jun, 2015 - Comments: 1

Historically, formal verification technology has been licensed as a compre- hensive suite of tools that can be used to address a broad range of formal verification applications and problems. Such deployment required a wide range of in-depth skills on the user’s part before the technology could be leveraged by not only first time users, but also experienced ones. New users were often overwhelm... » read more

Full Coverage Or Full Monty
By Brian Bailey - 22 Jun, 2015 - Comments: 0

Without adequate coverage metrics and tools, verification engineers would never be able to answer the proverbial question: are we done yet? But a lot has changed in the design flow since the existing set of metrics was defined. Does it still ensure that the right things get verified, that time is not wasted on things deemed unimportant or a duplication of effort, and can it handle today’s hie... » read more

Foundries Expand Planar Efforts
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes. But that’s not the only action in the foundry arena. They are also expanding their efforts in the leading-edge planar market by rolling out new 28nm and 22nm processes. On one front, TSMC is offering new 28nm variants, based on bulk CMOS technology. And on an... » read more

Power Verification Now Required
By Ann Mutschler - 17 Jun, 2015 - Comments: 0

Today’s verification tasks may seem daunting — and much of it is — but all of it is absolutely necessary to make sure chips operate properly with a larger system. Throw power into the mix and the challenges mount. The good news is that there is no shortage of tools and methodologies to help with these tasks. The bad news is that even the best tools won’t make the challenges disappear... » read more

Blog Review: June 17
By Jesse Allen - 17 Jun, 2015 - Comments: 0

Can big data help farmers produce bigger crops? From Iowa to Indonesia, Rambus' Aharon Etengoff looks at programs combining sensors, drones, and analytics where narrowing the odds of the next catastrophic crop failure is just the beginning. Forget any preconceptions you might have about the non-profit sector, says ARM's Dominic Vergine. UNICEF's global procurement hub looks and runs like an ... » read more

Consolidation And Innovation
By Ed Sperling - 16 Jun, 2015 - Comments: 0

Consolidation is happening across the semiconductor industry, in ways that are very apparent and others that aren't so obvious. On the chipmaker side, NXP's acquisition of Freescale, Avago's acquisition of Broadcom and LSI, and Intel's acquisition of Altera are so big that they require approval by multiple governments. Less obvious are moves such as Apple's build out of its processor team, a... » read more

Managing Dynamic Power
By Ann Mutschler - 16 Jun, 2015 - Comments: 0

Working with finFETs is a study in contrasts. While leakage is now under control for the first time in several process generations due to the advent of different gate technology, dynamic power density caused by tightly packed transistors and higher clock speeds has become the big issue. “FinFET technology helps with reducing static/leakage power so when your logic is not active, you can sh... » read more

SoC Integration Headaches Grow
By Ed Sperling - 16 Jun, 2015 - Comments: 0

As the number of IP blocks grows, so do the headaches of integrating the various pieces and making sure they perform as planned within a prescribed power envelope. This is easier said than done, particularly at the most advanced process nodes. There are more blocks, more power domains, more states and use-model dependencies, and there is much more contention for memories. There are physical ... » read more

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