tag: co-packaged optics

Enabling The 448G Era: System Architecture And Standards For Next-Gen AI Networks
By Synopsys - 15 Oct, 2025 - Comments: 0

As Artificial Intelligence (AI) and Machine Learning (ML) workloads continue to reshape data center infrastructure, the need for higher bandwidth and lower latency has accelerated the need for a next-generation Ethernet. This white paper examines the industry’s shift toward 448G signaling—driven by scale-up and scale-out AI cluster demands—and outlines the evolving system architecture... » read more

What Do LLMs Want from Hardware
By Geoff Tate - 08 Sep, 2025 - Comments: 0

Figure 1: Noam Shazeer, Google Gemini vice president, presented this in his Hot Chips 2025 talk. Noam Shazeer is Google’s vice president of engineering for Gemini, their LLM competitor to ChatGPT. He talked recently at Hot Chips: “Predictions for the Next Phase of AI." He has worked on LLMs for a decade since inventing the transformer model in 2017. As his slide says, LLMs can take adv... » read more

Challenges In Stacking HBM
By Ed Sperling - 03 Sep, 2025 - Comments: 1

AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

Research Bits: August 19
By Jesse Allen - 19 Aug, 2025 - Comments: 0

Co-packaged optics Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to co-package photonic and electronic chips that uses existing automated pick-and-place assembly equipment in traditional fabs along with a less-expensive passive alignment process. “We’ve developed a packaging design [for integrating photonics with el... » read more

Transforming Test For Co-packaged Optics
By Laura Peters - 12 Aug, 2025 - Comments: 0

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the fronts of racks into the same package as the networking switch and HBMs, AI programs that used to take a week to run can now be completed in a day. To enable this change in production manufacturi... » read more

Can Cheaper Lasers Handle Short Distances?
By Bryon Moyer - 04 Aug, 2025 - Comments: 0

Optical technology is well established for long-haul communications, but the distances it serves are shrinking — especially in the data center. Vertical-cavity surface-emitting lasers (VCSELs) already drive short fiber links. But efforts are underway to further scale them down to provide more connections through waveguides than fiber can provide. “We have seen the transition from long... » read more

Can Today’s Processor Architectures Be More Efficient?
By Bryon Moyer - 17 Jul, 2025 - Comments: 3

For years, processors focused on performance, and that performance had little accountability to anything else. Performance still matters, but now it must be accountable to power. If small gains in performance result in disproportionate power gains, designers may need to discard such improvements in favor of more power-efficient ones. Although current architectures undergo a steady cadence of... » read more

Co-Designing Data Center Architecture To Support LLMs (Intel, Georgia Tech)
By Technical Paper Link - 14 Jul, 2025 - Comments: 0

A new technical paper titled "Scaling Intelligence: Designing Data Centers for Next-Gen Language Models" was published by Intel Corporation and Georgia Tech. An excerpt from the paper's abstract: "Our work provides a comprehensive co-design framework that jointly explores FLOPS, HBM bandwidth and capacity, multiple network topologies (two-tier vs. FullFlat optical), the size of the scale-ou... » read more

Testing At The Speed Of Light: Enabling Scalable Optical Testing For Silicon Photonics And CPO
By Matthew Griffin - 10 Jul, 2025 - Comments: 0

Today, a single ChatGPT query consumes roughly ten times more power than a traditional Google search and will only continue to grow as AI extends to image and video generation. With this growth not only in AI, but also in cloud computing and high-performance computing (HPC), data center electricity consumption is projected to account for up to 9.1% of total U.S. electricity use by 2030. ... » read more

Novel Assembly Approaches For 3D Device Stacks
By Laura Peters - 30 Jun, 2025 - Comments: 0

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

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