What’s Next For Transistors And Chiplets


Sri Samavedam, senior vice president of CMOS Technologies at Imec, sat down with Semiconductor Engineering to talk about finFET scaling, gate-all-around transistors, interconnects, packaging, chiplets and 3D SoCs. What follows are excerpts of that discussion. SE: The semiconductor technology roadmap is moving in several different directions. We have traditional logic scaling, but packaging i... » read more

Software-Hardware Co-Design Becomes Real


For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

The Next Generation Of General-Purpose Compute At Hot Chips


At the recent HOT CHIPS, the first day opened with the chips that you first think of when you hear the word processor. These are the next generation of chips from the likes of Intel, AMD, and IBM. There were lots of other chips too, such as Arm's Neoverse N2, and NVIDIA's new data-processing unit (DPU), or AMD's next-generation graphics architecture. But for this post, anyway, I'm going to focu... » read more

New Power, Performance Options At The Edge


Increasing compute intelligence at the edge is forcing chip architects to rethink how computing gets partitioned and prioritized, and what kinds of processing elements and memory configurations work best for a particular application. Sending raw data to the cloud for processing is both time- and resource-intensive, and it's often unnecessary because most of the data collected by a growing nu... » read more

The Future Of Transistors And IC Architectures


Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. What follows are excerpt... » read more

Tradeoffs To Improve Performance, Lower Power


Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Have Processor Counts Stalled?


Survey data suggests that additional microprocessor cores are not being added into SoCs, but you have to dig into the numbers to find out what is really going on. The reasons are complicated. They include everything from software programming models to market shifts and new use cases. So while the survey numbers appear to be flat, market and technology dynamics could have a big impact in resh... » read more

Customization And Limitations At The Edge


Semiconductor Engineering sat down to discuss the edge constraints and the need for security with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of... » read more

The Murky World Of AI Benchmarks


AI startup companies have been emerging at breakneck speed for the past few years, all the while touting TOPS benchmark data. But what does it really mean and does a TOPS number apply across every application? Answer: It depends on a variety of factors. Historically, every class of design has used some kind of standard benchmark for both product development and positioning. For example, SPEC... » read more

Simultaneous Localization And Mapping


Amol Borkar, senior product manager at Cadence, explains how to track the movement of an object in a scene and how to match features from one image to the next using SLAM. The technology is used in everything from mobile phones to automotive and drones. » read more

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