Week in Review: IoT, Security, Auto


Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Week In Review: Design, Low Power


Cadence taped out a complete GDDR6 memory IP solution consisting of PHY, controller and Verification IP on Samsung's 7LPP process. The GDDR6 IP allows up to 16Gb/sec bandwidth per pin, or over 500Gb/sec peak bandwidth between the SoC and each GDDR6 memory die. It is targeted at very high-bandwidth applications including AI, cryptocurrency mining, graphics, ADAS and HPC. ClioSoft debuted a So... » read more

Fan-Out Wars Begin


Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Semicon West Preview: Packaging


By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more