tag: deposition

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

Inside Process Technology
By Mark LaPedus - 21 Apr, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss the foundry business, memory, process technology, lithography and other topics with David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], a supplier of predictive modeling tools. What follows are excerpts of that conversation. SE: Chipmakers are ramping up 16nm/14nm finFETs today, with 10nm and 7nm finFETs just around... » read more

Inside Multi-Beam E-Beam Lithography
By Mark LaPedus - 19 Nov, 2015 - Comments: 4

Semiconductor Engineering sat down with David Lam, chairman of Multibeam, a developer of multi-beam e-beam tools for direct-write lithography applications. Lam is also a venture capitalist. He founded Lam Research in 1980, but left as an employee in 1985. What follows are excerpts of that conversation. SE: How has the equipment business changed over the years and what’s the state of the i... » read more

Memory Hierarchy Shakeup
By Mark LaPedus - 16 Sep, 2015 - Comments: 0

It’s no secret that today’s memory chips and storage devices are struggling to keep up with the growing demands in data processing. To solve the problem, chipmakers have been working on several next-generation memory types. But most technologies have been delayed or fallen short of their promises. But after numerous delays, a new wave of next-generation, nonvolatile memories are finally ... » read more

Manufacturing Bits: May 5
By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

Flash Dance For Inspection And Metrology
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

Chipmakers are moving from planar technology to an assortment of 3D-like architectures, such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one surprising and oft-forgotten technology is emerging as perhaps the biggest challenge in both logic and memory—process control. Process control includes metrology and wafer inspection. Metrolo... » read more

Challenges Mount For Patterning And Masks
By Mark LaPedus - 06 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="80" comment="lithography"] and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief execu... » read more

Challenges Mount For Patterning And Masks
By Mark LaPedus - 30 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief executive at [getentity id="228... » read more

Fab Tool R&D And Ramen Noodles
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

The semiconductor equipment and materials industry has always been a tough business. Over the years, vendors have been under pressure to develop new technologies for a shrinking but demanding customer base. And as a result, many vendors could not keep up, or elected to exit the business, causing a massive shakeout in the industry. It isn’t getting any easier, though. Today, tool and... » read more

Challenges Mount For EUV Masks
By Mark LaPedus - 16 Oct, 2014 - Comments: 2

Five years ago, Intel urged the industry to invest millions of dollars in the photomask infrastructure to help enable extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. At the time, there were noticeable gaps in EUV, namely defect-free masks and inspection tools. To date, however, Intel’s call to action has produced mixed results. The photomask industry is making progr... » read more

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