Efficient LLM Inference With Limited Memory (Apple)


A technical paper titled “LLM in a flash: Efficient Large Language Model Inference with Limited Memory” was published by researchers at Apple. Abstract: "Large language models (LLMs) are central to modern natural language processing, delivering exceptional performance in various tasks. However, their intensive computational and memory requirements present challenges, especially for device... » read more

Package Propagation Delay Dependency Of Advanced Fly-By Routing For Next Generation DDR5


Package signal transit delay is an important parameter for high-speed designs like DDR5. Package delay along with PCB delay dictates the data rates of DDR5 interface running at 4.0 Gbps and beyond. From DDR3 (third generation DDR) onwards, daisy chain routing has been widely used as it can support high data rate operations by providing smaller trace stubs and capacitive loadings. Even so, beyon... » read more

Mixed SRAM And eDRAM Cell For Area And Energy-Efficient On-Chip AI Memory (Yale Univ.)


A new technical paper titled "MCAIMem: a Mixed SRAM and eDRAM Cell for Area and Energy-efficient on-chip AI Memory" was published by researchers at Yale University. Abstract: "AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies... » read more

The Uncertain Future Of In-Memory Compute


Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

Alleviating the DRAM Capacity Bottleneck in Consumer Devices with NVMs


A new technical paper titled "Extending Memory Capacity in Modern Consumer Systems With Emerging Non-Volatile Memory: Experimental Analysis and Characterization Using the Intel Optane SSD" was published by researchers at ETH Zurich, University of Illinois Urbana-Champaign, Google, and Rivos. Abstract Excerpt "DRAM scalability is becoming a limiting factor to the available memory capacity in... » read more

DRAM Choices Are Suddenly Much More Complicated


Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs. Despite years of predictions that DRAM would be replaced by other types of memory, it remains an essential component in nearly all computing. Rather than fading away, its footprint is increasing,... » read more

SRAM In AI: The Future Of Memory


Experts at the Table — Part 1: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part two of this conversation can be found here and part three is here. [L-R]: ... » read more

The Power Of HBM3 Memory For AI Training Hardware


AI training data sets are constantly growing, driving the need for hardware accelerators capable of handling terabyte-scale bandwidth. Among the array of memory technologies available, High Bandwidth Memory (HBM) has emerged as the memory of choice for AI training hardware, with the most recent generation, HBM3, delivering unrivaled memory bandwidth. Let’s take a closer look at this important... » read more

A Novel Approach To Mitigating RowHammer Attacks And Improving Server Memory System Reliability


A technical paper titled “RAMPART: RowHammer Mitigation and Repair for Server Memory Systems” was published by researchers at Rambus. Abstract: "RowHammer attacks are a growing security and reliability concern for DRAMs and computer systems as they can induce many bit errors that overwhelm error detection and correction capabilities. System-level solutions are needed as process technology... » read more

DRAM Test And Inspection Just Gets Tougher


DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

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