Blog Review: March 26


Synopsys’ Eric Huang has discovered a video of Superman using a GoPro camera (scroll down to bottom of page). So this is what it’s like to stop bullets with your hand. Cadence’s Tom Hackett zeroes in on mobile interfaces in a video—SoC fabric, memory and chip-to-chip. Nice whiteboard drawing. Mentor’s Anil Khanna looks at a methodology for developing high-performance embedded so... » read more

Litho Is Out Of Sync


EUV’s repeated missed deadlines, and the slow-motion response by the rest of the industry to fill the void with alternatives, is having ripple effects in every facet and corner of the semiconductor industry. It’s making design harder and more expensive, introducing potential errors into the DFM flow, and greatly increasing the amount of time it takes to process wafers. It’s also adding a ... » read more

Directed Self-Assembly Gains Momentum


At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Under The Radar At SPIE


At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

EUV Reaches A Crossroads


[gettech id="31045" comment="EUV"] (EUV) [getkc id="80" comment="lithography"] is at a crossroads. 2014 represents a critical year for the technology. In fact, it may answer a pressing question about EUV: Does it work or not? It’s too early to make that determination right now, but there are more uncertainties than ever for the oft-delayed technology. Originally aimed for the 65nm node in... » read more

One-on-One: Naoya Hayashi


Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

Advanced Lithography: Moore’s Law Moves On


Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

More Pain In More Places


Pain is nothing new in to the semiconductor industry. In fact, the pain of getting complex designs completed on budget, and finding the bugs in those designs, has been responsible for decades of continuous growth in EDA, IP, test, packaging, and foundries. But going forward there is change afoot in every segment of the flow from architecture to design to layout to verification to manufacturi... » read more

Next-Generation Lithography


Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks. [youtube vid=L96vi-BjhDU] » read more

Tech Talk: Multipatterning


Mentor Graphics' David Abercrombie shows how multi patterning is supposed to be done, and what sorts of problems can crop up along the way. Now that EUV has hit another hiccup, the semiconductor industry has little choice. [youtube vid=tOs_OMSh4Nk] » read more

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