tag: finFETs

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect
By Norman Chang - 15 Oct, 2015 - Comments: 0

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

Abstraction: Necessary But Evil
By Brian Bailey - 14 Oct, 2015 - Comments: 1

Abstraction allows aspects of a design to be described in an executable form much earlier in the flow. But some abstractions are breaking down, and an increasing amount of lower-level information has to be brought upstream in order to provide estimates that are close enough to reality so informed decisions can be made. The value of abstractions in design cannot be overstated. High levels of ... » read more

How Long Will FinFETs Last? (Part 3)
By Ann Mutschler - 07 Oct, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss how long [getkc id="185" kc_name="FinFET"]s will last and where we will we go next with Vassilios Gerousis, Distinguished Engineer at [getentity id="22032" e_name="Cadence"]; Juan Rey, Sr. Director of Engineering for Calibre R&D at [getentity id="22017" e_name="Mentor Graphics"]; Kelvin Low, Senior Director Foundry Marketing at [getentity id="22... » read more

Pick A Number
By Ed Sperling - 24 Sep, 2015 - Comments: 0

For the past two years there was some mumbling that 16/14nm would be short-lived, and that 10nm would be the place that foundries would invest heavily. Now the buzz is that 10nm may be skipped entirely and the next node will be 7nm. After all, 10nm is really only a half-node. Or is it? The answer depends on who's defining 10nm. The 16/14nm node is based on a 20nm back-end-of-line process, un... » read more

The Price Of Consolidation
By Ed Sperling - 24 Sep, 2015 - Comments: 0

Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled with the rising cost and difficulty of shrinking features down to advanced process nodes—many argue that is the largest driver of consolidation—the market dynamics for who's buying IP, EDA t... » read more

FinFET Technology
By Synopsys - 23 Sep, 2015 - Comments: 0

This white paper discusses the major challenges with FinFETs and how TSMC has been collaborating with Synopsys, one of their ecosystem partners, to deliver a complete solution. Key elements of this solution include comprehensive FinFET profiling without impact to design tool runtime and proven, verified IP availability. The TSMC 16-nm FinFET solution will ensure mutual customers swiftly move to... » read more

Raise A Fence, Dig A Tunnel, Build A Bridge
By Ed Sperling - 17 Sep, 2015 - Comments: 0

There are three main options for chipmakers over the course of the next decade. Which option they choose depends upon their individual needs, talents, and how much and what kind of differentiation they believe will matter to them. The options roughly fall into three categories—fence, bridge or tunnel. The fence option Rather than changing anything, the entire ecosystem can stick to wha... » read more

ALD Market Heats Up
By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup the landscape by rolling out a new, high-throughput ALD tool. Generally, [getkc id="250" kc_name="ALD"] is a process that deposits materials layer-by-layer at the atomic level, enabling thin and ... » read more

Executive Insight: Charlie Cheng
By Ed Sperling - 14 Sep, 2015 - Comments: 1

Charlie Cheng, CEO of Kilopass, sat down with Semiconductor Engineering to talk about issues with current memory types and why the market is ready for disruptive approaches to reduce power and cost. SE: What's changing in the memory space? Cheng: Memory is a very important building block. It's a foundation and a commodity for a chip and for the system, but if you look at the big picture, ... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy