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Advanced Outlier Die Control Technology In Fan-Out Panel Level Packaging Using Feedforward Lithography


The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Fan-out panel level packaging (FOPLP) is one of the technologies that... » read more

What Does It Take To Build A Successful Multi-Chip Module Factory?


When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an announcement about “Company XYZ” moving their products into the fan-out wafer-level packaging (FOWLP) or fan-out panel-level packaging (FOPLP) space. But these moves come with challenges that didn’t ex... » read more

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP


Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more