tag: IBM

Speed Sells
By Ed Sperling - 13 Sep, 2012 - Comments: 0

The good news is that the new iPhone battery lasts at least as long as the old one. The bad news is that Apple hasn’t offered double battery life and equivalent performance as an option for mobile users that need extended times between charges. They’re not alone, of course. At the Intel Developer Forum this week, Intel Chief Product Officer Dadi Perlmutter talked about voice and gesture-... » read more

Modeling the Future
By Ann Mutschler - 13 Sep, 2012 - Comments: 0

Every once in a while I read through the employment listings as part of the Semiconductor Manufacturing group on LinkedIn because I find it fascinating to see what employers are looking for even if I am not applying. Particularly for verification engineering position, one of the job responsibilities typically includes development of the architecture for a functional verification environment ... » read more

IBM’s Power7+ Processor
By Barry Pangrle - 12 Sep, 2012 - Comments: 0

By Barry Pangrle Hot Chips 24 was held Aug. 27-29 with tutorials on the first day and 30-minute technical presentations plus keynote addresses on the second and third days. There were a lot of great presentations and Hot Chips is definitely one of my favorite conferences. So out of all of the presentations, why did I choose IBM’s Scott Taylor’s on Power7+? Well, it’s likely that I’l... » read more

Ivy Bridge Settles Old Bet
By Marc David Levenson - 16 Aug, 2012 - Comments: 0

Think back seven years to 2005. Those were boom times with the housing market rising, the dollar high, 65nm node chips on the horizon and EUV the great future lithography hope. EUVL was late for the next (45nm) node, but a great new idea had appeared to fill the gap—water immersion scanning with 193nm exposure! But how far could wet 193nm lithography go before EUVL or some new thing, such as ... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

G450C To Align Vendors During 450mm Transition
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By David Lammers Innovation and synchronization among multiple companies do not often go hand in hand. But for the 450mm wafer transition to provide its full benefits, chip makers and their suppliers will need to do more than a simple wafer size scale up. That may lead the Global 450 Consortium (G450C) to serve as the proving ground for efforts to more closely match the electrical results o... » read more

The Easy Stuff Is Over
By Ed Sperling - 09 Aug, 2012 - Comments: 0

By Ed Sperling Doomsayers have been predicting the end of Moore’s Law for the better part of a decade. While it appears that it will still remain viable for some companies—Intel and IBM already are looking into single digits of nanometers and researchers speculating about picometer designs—for most companies the race is over. Progress will still be made in moving SoCs from one node to... » read more

Experts At The Table: Multipatterning
By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael White, physical verification product line manager at Mentor Graphics; Luigi Capodieci, R&D fellow at GlobalFoundries; Lars Liebmann, IBM distinguished engineer; Rob Aitken, ARM fellow; Jean-Pierre Geronimi, CAD director at STMicroelectronics; and Kuang-Kuo Lin, director of foundry design enablement at Samsung El... » read more

Capping Tools Tame Electromigration
By Mark LaPedus - 31 Jul, 2012 - Comments: 0

By Mark LaPedus The shift towards the 28nm node and beyond has put the spotlight back on the interconnect in semiconductor manufacturing. In chip scaling, the big problem in the interconnect is resistance-capacitance (RC). Another, and sometimes forgotten, issue is electromigration. “Electromigration gets worse in device scaling,” said Daniel Edelstein, an IBM Fellow and manager of BE... » read more

Investment Options
By Ed Sperling - 31 Jul, 2012 - Comments: 0

It's clear that something fundamental has changed in the semiconductor manufacturing industry. What's less clear is how this will play out over the long term. Intel's agreement to invest more than $4 billion in ASML to ensure the continued development of EUV and 450mm wafer technology is more than just a one-off deal. It's a very public recognition that the astronomical cost of design and ma... » read more

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