The Integrated IP Subsystem: A Converging SoC Solution


The consumer device market is witnessing incredible market space convergence between mobile handheld, automotive, and home electronics. IP vendors, engineers, and system design engineers face a multitude of challenges when designing and developing ICs, systems, or subsystems for the next great portable device. The next cell phone for instance, will not only be a multimedia player, but also a de... » read more

Faster IP Integration


By Ed Sperling System-Level Design sat down with Laurent Moll, chief technology officer at Arteris, to talk about interoperability, complexity and integration issues. What follows are excerpts of that conversation. SLD: What’s the big challenge with IP? Moll: Interoperability is always a concern. Because of ARM’s dominance, a lot of people are moving to AMBA protocols, whether that’... » read more

Experts At The Table: Performance Analysis


Low-Power/High-Performance Engineering sat down with Ravi Kalyanaraman, senior verification manager for the digital entertainment business unit at Marvell; William Orme, strategic marketing manager for ARM’s System IP and Processor Division; Steve Brown, product marketing and business development director for the systems and software group at Cadence; Johannes Stahl director of product market... » read more

De-Mystifying The SoC Supply Chain


By Barbara Jorgensen At the heart of every supply chain operation is the desire to mitigate risk. In theory, a supply chain allows a customer to leverage the best of the best in technology, logistics or production at a lower cost than DIY (do it yourself.) The system on chip (SoC) supply chain is no different—there’s a whole ecosystem in the semiconductor industry that supports design, pro... » read more

Faster Assembly Required


Speeding up production has been a mantra dating back throughout recorded history, and presumably well before that. That’s what technology was created for—roads, bridges aqueducts, computers, the Internet, and everything that connects the real to the virtual world. A speech by Nvidia chief scientist Bill Dally at DAC that complex SoCs should only take a couple weeks to design by two guys ... » read more

From Design to Test: Developing High-Reliability MTP NVM


In developing high-quality and reliable MTP NVM, NVM IP providers must account for design and architectural considerations as well as comprehensive silicon testing. To help system-on-chip (SoC) designers select the highest reliability NVM IP, this white paper will review the key considerations involved in the entire process from design to test, including: key reliability specifications; designi... » read more

Drowning In Data


By Ed Sperling The old adage, “Be careful what you wish for,” has hit the SoC design market like a 100-year storm. After years of demanding more data to understand what’s going on in a design, engineering teams now have so much data that they’re drowning in it. This is most obvious at advanced process nodes, of course. But it’s also true these days at more mainstream nodes such as... » read more

The Week In Review: May 31


By Ed Sperling Mentor Graphics and GlobalFoundries teamed up to deliver 20nm design kits that include Mentor’s place and route tool, including verification and conflict resolution engines for double-patterning violations. The 20nm process is used for GlobalFoundries’ 14nm finFETs. Mentor also received 16nm finFET certification from TSMC for the same tools plus its physical verification pl... » read more

The X Factor


By Ed Sperling The number of unknowns is growing in every segment of SoC design all the way through manufacturing, raising the stakes between reliability and the tradeoffs necessary to meet market windows. Tools are available to deal with some of these unknowns, or X’s, but certainly not all of them. Moreover, no single tool can handle all unknowns, some of which can build upon other unkn... » read more

Experts At The Table: The Internet Of Everything


By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

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